GE MIFIIPI55E10HI00 Feeder Relay | High-Density Ethernet Interface
Manufacturer: GE Fanuc
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Part Number: MIFIIPI55E10HI00
Condition:New with Original Package
Product Type: High-Density Ethernet Interface
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Multilin MIFIIPI55E10HI00 – Product Description
Overview
The GE Multilin MIFIIPI55E10HI00 Feeder Relay Module provides high‑density Ethernet connectivity and reliable integration for industrial automation networks. It supports multiple protocols for distributed control systems, ensuring seamless communication and real-time process monitoring. Moreover, its compact design allows installation in tight control cabinet spaces while maintaining rugged reliability.
Technical Specifications
Power Supply: 10–30 VDC (nominal 24 VDC)
Network Interface:
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10/100/1000 Mbps Ethernet
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Copper and fiber options depending on configuration
Functions:
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High-density I/O communication
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Protocol integration for distributed control
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Supports multiple industrial automation protocols
Performance:
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High-speed data exchange for real-time process control
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Fault-tolerant and reliable for continuous industrial operation
Environmental Ratings:
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Operating temperature: –20 °C to +70 °C
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Storage temperature: –40 °C to +85 °C
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Protection rating: IP65
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Optional conformal coating for harsh conditions
Physical Specifications:
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Dimensions: 150 mm × 100 mm × 50 mm
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Weight: 2 kg
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Compact modular design for rack or panel installation
FAQ
Q1: Which industrial protocols does this module support?
It supports Ethernet-based protocols, including Honeywell Experion PKS integration.
Q2: Can it handle high-density I/O systems?
Yes, it manages multiple I/O channels and high-speed data exchange.
Q3: What is the operating temperature range?
It operates reliably between –20 °C and +70 °C.
Q4: Is it suitable for harsh environments?
Yes, with IP65 rating and optional conformal coating for industrial conditions.
Q5: How is the module installed?
It can be installed in control panels or rack-mounted systems with a compact footprint.