16 Input 16 Output Relay Module | GE IC200MDD845G VersaMax
16 Input 16 Output Relay Module | GE IC200MDD845G VersaMax
16 Input 16 Output Relay Module | GE IC200MDD845G VersaMax
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16 Input 16 Output Relay Module | GE IC200MDD845G VersaMax

  • Manufacturer: GE Fanuc

  • Part Number: IC200MDD845G

  • Condition:New with Original Package

  • Product Type: Digital I/O Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

 

GE Fanuc IC200MDD845G VersaMax Mixed Discrete I/O Module

The GE Fanuc IC200MDD845G, also cataloged as the IC200MDD845G Mixed Discrete Input/Output Module, operates as a dedicated hardware component for discrete signal acquisition and relay output execution within VersaMax I/O control networks. The card combines 16 discrete DC inputs and 16 Form A relay outputs on a single rack footprint. Field circuits maintain 1500 V isolation from internal system logic to prevent ground loop propagation across backplane buses.

Hardware Specifications

Parameter Specification
Model IC200MDD845G
Brand GE Fanuc
Origin USA
Weight 0.54 kg (1.2 lbs)
Dimensions 292.1 x 208.3 x 88.9 mm (11.5 x 8.2 x 3.5 in)
Operating Temp -10 deg C to +55 deg C
Power Consumption Less than 5 W (<= 270 mA at 5 VDC backplane draw)
Input Channels 16 discrete DC inputs (12-48 VDC, positive logic)
Input Current 2 to 5 mA per channel typical
Output Channels 16 Form A relay outputs (individually isolated)
Contact Rating 2.0 A resistive (5-30 VDC / 5-265 VAC), 0.2 A resistive (31-125 VDC)
Circuit Isolation 1500 V field-to-logic isolation
Status Indicators Channel status LEDs (16 Input, 16 Output), Module OK LED
Mounting Options Standard DIN rail or direct panel mounting

Backplane Integration and Firmware Compatibility

The module executes parallel data transfers over the VersaMax backplane bus, enabling high-density channel updates without increasing processor scan times. Internal control logic maintains firmware flash compatibility with VersaMax CPUs, allowing seamless parameterization via standard programming tools. High I/O density scaling reduces total carrier space requirements while supporting real-time signal processing across complex automated architectures.

Frequently Asked Questions

Q: What is the backplane current load imposed by the IC200MDD845G module?

A: The module draws a maximum backplane current of 270 mA at 5 VDC under full operational loading.

Q: Are the 16 relay output channels isolated from each other?

A: Yes, all 16 Form A relay output channels feature individual isolation, enabling control across distinct AC and DC load voltage sources.

Field Installation Guidelines

Mount the IC200MDD845G module onto a compatible VersaMax carrier, such as the IC200CHS022G base, secured to a 35 mm DIN rail or panel surface. Ensure power to the backplane base is completely disconnected prior to seating or unseating the module to prevent electrical arcing.

Wire the 16 DC input channels and 16 relay output points to their respective terminal blocks, observing individual terminal isolation. Do not combine input and output wiring on shared common lines. When switching inductive devices like solenoids or contactor coils, install external suppression components (RC networks for AC loads or flyback diodes for DC loads) directly across the field device terminals to extend relay contact life. Maintain a minimum separation of 200 mm between low-voltage DC signal cables and high-voltage power lines to prevent electromagnetic coupling.

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