1769-IA8I Allen-Bradley 8-path isolated AC input module for I/O
1769-IA8I Allen-Bradley 8-path isolated AC input module for I/O
1769-IA8I Allen-Bradley 8-path isolated AC input module for I/O
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1769-IA8I Allen-Bradley 8-path isolated AC input module for I/O

  • Manufacturer: Allen Bradley

  • Part Number: 1769-IA8I

  • Condition:New with Original Package

  • Product Type: Digital Input Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

Allen-Bradley 1769-IA8I Compact I/O Digital Input Module

The Allen-Bradley 1769-IA8I, also cataloged as the 1769-IA8I Digital Input Module, operates as a dedicated hardware component for AC signal monitoring within CompactLogix and MicroLogix 1500 controller networks.

Hardware Specifications

Parameter Specification
Model 1769-IA8I
Brand Allen-Bradley
Origin USA
Weight 0.23 kg (0.51 lb)
Dimensions 118 mm x 35 mm x 87 mm
Operating Temp 0 to +60 deg C
Power Consumption 0.45 W (90 mA @ 5 VDC bus current draw)
Input Channels 8 individually isolated
Voltage Category 100/120 VAC
Operating Voltage Range 79-132 VAC
Frequency Range 47-63 Hz
On-State Voltage (min) 79 VAC
On-State Current 5 mA @ 79 VAC (min), 12 mA @ 120 VAC (nominal)
Off-State Voltage (max) 20 VAC
Off-State Current (max) 2.5 mA
Signal Delay 20 ms ON / 20 ms OFF
Isolation 1517 VAC for 1 s or 2145 VDC for 1 s (IEC Class II reinforced)
Nominal Impedance 12 kOhm @ 50 Hz, 10 kOhm @ 60 Hz
Heat Dissipation 1.81 W
Power Supply Distance Rating 8 modules maximum from power supply
Storage Temperature -40 to +85 deg C
Relative Humidity 5% to 95% non-condensing
Mounting Options DIN-rail or panel mount
Certifications UL, CE, IECEx, ATEX

Industrial Control & Deterministic Network Features

The module interfaces directly with the controller backplane, utilizing dedicated bus communication velocity mechanisms to transfer channel states within deterministic execution frames. The eight input channels feature complete electrical segmentation via integrated optical isolation, minimizing cross-channel interference and preventing localized transient events from disrupting adjacent bus operations. Signal processing circuits apply fixed hardware input filtering to suppress high-frequency noise induced by surrounding field wiring. Firmware flash compatibility checks ensure synchronization with the controller operating system, preventing version mismatches during high-density I/O scaling expansions.

Frequently Asked Questions

Q: What is the maximum distance this module can be installed from the system power supply?

A: The module has a power supply distance rating of 8. It must be located within 8 slots of an applicable Compact I/O power supply to maintain proper backplane voltage regulation.

Q: Can channels on the same module be connected to different AC phases?

A: Yes. Because all 8 channels are individually isolated with a reinforced isolation rating of 1517 VAC for 1 second, distinct channels can monitor signals from separate AC phases without risk of phase-to-phase shorts.

Q: Is hot-swapping supported for this module during controller runtime?

A: No. Compact I/O modules do not support Removal and Insertion Under Power (RIUP). Power to the controller backplane and all field-side power must be completely disconnected before removing or inserting the hardware component.

Field Installation Guidelines

  • Mounting Setup: Secure the module onto an EN 50022 compliant 35 mm x 7.5 mm DIN-rail or attach it directly to a rigid interior panel via the integrated mounting holes.
  • Bus Connection: Slide the module firmly into the adjacent slot until the integrated 1769 bus connectors mesh securely. Lock the bus latches to maintain mechanical rigidity and ensure continuous electrical continuity across the backplane.
  • Wiring Configurations: Route field wiring away from high-voltage motor conductors or variable frequency drive cables. Maintain physical separation between the low-voltage backplane bus links and the high-voltage 120 VAC input conduits.
  • Grounding Requirements: Ensure the DIN-rail or sub-panel is bonded directly to the functional earth ground of the enclosure via a low-impedance copper strap to mitigate ambient electromagnetic noise.
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