1769-L19ER-BB2B Allen-Bradley 1769 CompactLogix 5370 L1 Controller
1769-L19ER-BB2B Allen-Bradley 1769 CompactLogix 5370 L1 Controller
1769-L19ER-BB2B Allen-Bradley 1769 CompactLogix 5370 L1 Controller
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1769-L19ER-BB2B Allen-Bradley 1769 CompactLogix 5370 L1 Controller

  • Manufacturer: Allen Bradley

  • Part Number: 1769-L19ER-BB2B

  • Condition:New with Original Package

  • Product Type: Programmable Automation Controllers

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

Allen-Bradley 1769-L19ER-BB2B CompactLogix Controller

Configured for machine control and process automation in industrial automation platforms, the Allen-Bradley 1769-L19ER-BB2B (1769-L19ER-BB2B CompactLogix 5370 L1 Controller) provides direct physical/electrical execution. This programmable automation controller executes logic processing, embedded digital I/O switching, and deterministic EtherNet/IP communications across localized machinery networks.

Suffix Breakdown & Model Matrix

The base hardware designation dictates the architectural layout and integrated options for the CompactLogix 5370 L1 series:

  • 1769: Identifies the core CompactI/O platform compatibility.
  • L19ER: Designates the L1 controller tier featuring 1 MB of user memory, dual EtherNet/IP ports, and support for up to 8 local expansion modules.
  • BB2B: Specifies the baseboard configuration consisting of 16 integrated 24 VDC digital inputs and 16 integrated 24 VDC digital outputs. (Note: Variation model 1769-L19ER-BB1B shares identical processing metrics and functional memory allocation under alternate manufacturing revisions).

Hardware Specifications

Parameter Specification
Model 1769-L19ER-BB2B
Brand Allen-Bradley / Rockwell Automation
Origin USA
Weight 0.31 kg (0.68 lb)
Dimensions 100 mm x 132 mm x 105 mm
Operating Temp 0 to 60 deg C
Power Consumption 4.5 W maximum power dissipation
User Memory 1 MB
Non-Volatile Storage 1 GB SD Card included (expandable up to 2 GB)
Embedded I/O 16 Digital Inputs (24 VDC), 16 Digital Outputs (24 VDC)
Local Expansion Up to 8 modules maximum
EtherNet/IP Nodes Up to 20 nodes maximum
Backplane Current 560 mA @ 5 VDC
Isolation Voltage 30 V continuous (basic insulation type)
Software Support RSLogix 5000 / Studio 5000 Logix Designer

Industrial Networks & Density Scaling Features

The internal design utilizes a high-speed backplane bus communication velocity architecture that optimizes data throughput between the main processor and up to 8 local expansion modules. The integrated dual EtherNet/IP ports support Device Level Ring (DLR) topology, which provides deterministic network redundancy and media fault detection directly at the controller interface. System engineers scale I/O density by mapping remote nodes via the EtherNet/IP network up to the maximum limit of 20 nodes, while open socket capabilities allow direct communication scripts with industrial printers, barcode readers, and weight scales. Firmware flash compatibility rules dictate that the hardware runtime must strictly align with the corresponding Studio 5000 Logix Designer application version to prevent execution faults during online runtime changes.

Frequently Asked Questions

  • Q: Does this controller support hot-swapping (Removal and Insertion Under Power) of local I/O modules?

    A: No. You must isolate system power before adding or removing local expansion modules from the 1769 backplane bus. Attempting RIUP causes backplane damage and processor faults.

  • Q: How does the dual-port Ethernet interface handle IP address assignment?

    A: The dual ports operate as an embedded switch sharing a single IP address. This design enables linear or Device Level Ring (DLR) network topologies without requiring external network switches.

  • Q: What is the consequence if the application logic exceeds the 560 mA backplane current draw at 5 VDC?

    A: Exceeding the 560 mA limit causes voltage drops across the backplane bus, leading to module communication drops or complete controller safety shutdowns. You must calculate the cumulative draw of all expansion modules and deploy supplementary power supplies if the calculation exceeds 560 mA.

Field Installation Guidelines

  • Mounting and Orientation: Mount the hardware horizontally onto a standard 35 mm DIN rail or secure it directly to the enclosure panel using the integrated mounting feet. Maintain a minimum clear distance of 50 mm on all sides to allow convective thermal heat dissipation.
  • Shielding and Grounding: Connect a dedicated, low-impedance copper functional earth wire from the DIN rail or panel grounding stud to the main enclosure ground bus. Ensure all communication shield lines terminate at a single point to prevent ground loops.
  • Wiring Separation: Route the 24 VDC incoming power lines and the embedded discrete I/O field wiring through separate wire ducts away from high-voltage AC motor drives and heavy inductive loads to prevent electromagnetic cross-talk.
  • SD Card Maintenance: Secure the protection door over the SD card slot during operation. Only replace or insert the non-volatile memory card when the controller status indicators show that no active read/write cycles are occurring.
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