1769-L23E-QB1B Allen Bradley CompactLogix Packaged Controller
Manufacturer: Allen Bradley
-
Part Number: 1769-L23E-QB1B
Condition：New with Original Package
Product Type: CPU Processors
-
Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Allen Bradley 1769-L23E-QB1B CompactLogix Packaged Controller
Configured for high-density local process execution and field device synchronization, the Allen Bradley 1769-L23E-QB1B (1769-L23E-QB1B CompactLogix Packaged Controller) provides direct physical/electrical execution. The unit contains embedded digital and analog I/O channels alongside integrated serial and network links to interface directly with sensors, switches, and distributed variable speed drives without external bus expansion hardware.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 1769-L23E-QB1B |
| Brand | Allen Bradley / Rockwell Automation |
| Origin | USA |
| Weight | 0.91 kg (2.00 lbs) |
| Dimensions | Standard 1769 L2 Form Factor |
| Operating Temp | 0 to 60 deg C |
| Storage Temp | -40 to 85 deg C |
| Power Consumption | 4.5 W power dissipation |
| User Memory | 1 MB (Note: certain sub-revisions utilize 512 KB) |
| Non-volatile Storage | 1 GB SD card included (expandable to 2 GB) |
| Embedded Digital I/O | 16 digital inputs, 16 digital outputs |
| Embedded Analog I/O | 4 analog inputs, 2 analog outputs |
| Backplane Current Draw | 1 A at 5 VDC, 710 mA at 24 VDC |
| Local Expansion Limits | Up to 2 additional 1769 I/O modules |
| Communication Ports | Dual Ethernet (DLR capable), 1 RS-232, 1 USB |
| Max Network Nodes | Up to 20 EtherNet/IP nodes |
| Isolation Voltage | 30 V continuous, basic insulation type |
| Vibration Tolerance | 10 to 500 Hz, 5 g acceleration |
Deterministic Network and Firmware Synchronization
The 1769-L23E-QB1B governs local system architecture loop execution by regulating backplane bus communication velocity across a maximum of 32 distinct programming tasks. Engineered for Profinet / EtherNet/IP deterministic networks, the integrated dual Ethernet ports use Device Level Ring (DLR) mechanism to sustain automation network uptime during physical cable damage. During routine initialization sequences, the controller validates internal firmware flash compatibility to check logic instructions against physical I/O allocations (100 programs per task limit). The hardware features strict I/O density scaling boundaries, constraining local expansion slots to prevent voltage drop across the integrated backplane connection rails.
Frequently Asked Questions
Q: How do the physical expansion limitations affect the installation of additional 1769 modules?
A: The 1769-L23E-QB1B electrical layout restricts the system to a maximum of 2 additional local 1769 Compact I/O modules. Attempting to install more than 2 local expansion modules causes a bus configuration failure and stops the processor backplane bus communication velocity from initiating.
Q: What actions are required regarding the hardware termination of the right side of the module array?
A: The final module in the physical architecture requires the installation of a 1769-ECR right end cap. Operating the system without this component leaves the backplane termination circuit open, resulting in an unrecoverable major controller fault.
Q: Which power source configurations drive this specific packaged controller model?
A: The 1769-L23E-QB1B functions via an integrated 24 VDC nominal power input terminal built directly into the housing. Unlike larger L3 controllers that accept independent modular AC supplies, this packaged version requires a external 24 VDC industrial power source.
Field Installation Guidelines
- Enclosure Grounding Path: Fasten a low-resistance copper conductor from the ground lug terminal of the unit straight to the single point ground block of the enclosure cabinet.
- Shield Continuity Maintenance: Terminate the shield drain wires of all embedded analog input and output cables at the nearest enclosure grounding panel, keeping the exposed wire lengths under 25 mm (1 inch).
- Conductor Sizing Restrictions: Strip and secure field connections utilizing copper wires sized between 22-14 AWG for solid lines, or 22-16 AWG for stranded lines, ensuring all conductors operate with a temperature rating above 90 deg C.
- Thermal Dissipation Margins: Maintain a minimal clearance boundary of 50 mm (2 inches) around all outer surfaces of the housing to facilitate vertical natural convection airflow during full load operating periods.