1769-L31 Allen-Bradley CompactLogix 1.5MB 512KB CPU Processor
1769-L31 Allen-Bradley CompactLogix 1.5MB 512KB CPU Processor
1769-L31 Allen-Bradley CompactLogix 1.5MB 512KB CPU Processor
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1769-L31 Allen-Bradley CompactLogix 1.5MB 512KB CPU Processor

  • Manufacturer: Allen Bradley

  • Part Number: 1769-L31

  • Condition:New with Original Package

  • Product Type: CPU Processors

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

Allen-Bradley 1769-L31 CompactLogix Controller

Configured for discrete, process, and motion execution paths in small to mid-range automation systems, the Allen-Bradley 1769-L31 (1769-L31 CompactLogix Controller) provides direct physical/electrical execution.

Hardware Specifications

Parameter Specification
Model 1769-L31
Brand Allen-Bradley / Rockwell Automation
Origin USA
Weight 0.80 kg
Dimensions 132.00 mm x 50.00 mm x 122.00 mm
Operating Temp 0 deg C to +60 deg C
Power Consumption 4.0 W
User Memory 512 KB / 1.5 MB platform variant limits
I/O Capacity Up to 16 local 1769 I/O modules
Communication Ports 2 x RS-232 serial ports (DF1, ASCII, Modbus RTU protocols)
Expansion Capabilities Supports network modules (EtherNet/IP, ControlNet, DeviceNet)
Motion Control Up to 4 axes via external SERCOS interface modules
Backplane Current Load 800 mA at 5 VDC
Storage Temp -40 deg C to +85 deg C
Relative Humidity 5% to 95% RH, non-condensing
System Software RSLogix 5000 / Studio 5000 Logix Designer

EtherNet/IP Deterministic Networks and Firmware Flash Compatibility

The 1769-L31 processor governs localized industrial operations through its internal backplane bus, demanding strict firmware flash compatibility verification with RSLogix 5000 or Studio 5000 environments to prevent system faults during runtime logic execution. Although native serial ports drive point-to-point DF1 interfaces, integration into EtherNet/IP deterministic networks requires adding network-specific communication modules to the local chassis structure. System engineering rules dictate precise calculation of the 800 mA backplane current draw against the power supply limits when scaling the local system architecture up to its maximum 16-module I/O density threshold.

Frequently Asked Questions

Q: Does the 1769-L31 unit allow live insertion or hot-swapping of adjacent local expansion modules while active?

A: No. The internal 1769 backplane architecture does not accommodate Online Insertion and Removal (RIUP). Users must entirely de-energize the master system power supply prior to adding, removing, or replacing any modules to avoid physical circuit damage or data corruption.

Q: How should engineers deploy network redundancies when connecting this serial controller to higher-level networks?

A: Because the 1769-L31 relies on built-in RS-232 interfaces, network redundancy can only be achieved by mounting a separate EtherNet/IP or ControlNet scanner module onto the local chassis bus, configuring the dual communication channels within the control software architecture.

Field Installation Guidelines

  • Chassis Attachment: Fit the module securely onto an industrial 35 mm DIN rail or fasten it directly onto a grounded metallic control backpanel. Slide the internal bus latches horizontally into the adjacent slot interfaces to complete the structural and electrical circuit connection.
  • Grounding Requirements: Run a low-impedance copper grounding conductor from the functional earth terminal directly to the central panel enclosure ground bus bar to protect internal microprocessor logic from electrical transients.
  • Serial Wiring Constraints: Utilize shielded serial communication cables for all RS-232 runs. Ensure these signal lines follow routing paths segregated from high-voltage AC motor lines to eliminate external electromagnetic interference.
  • Thermal Management Envelope: Maintain a physical clear space measuring no less than 50 mm above, below, and to the sides of the hardware cluster to promote steady convective airflow and keep operating temperatures inside the specified 60 deg C ceiling.
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