20C-DPI1 Allen-Bradley | PowerFlex 700H Communication Board

Allen-Bradley 20C-DPI1 PowerFlex 700H DPI Communication Option Board

Product Description

The 20C-DPI1 (20C-DPI1) is a specialized Drive Peripheral Interface (DPI) option board engineered specifically for the Allen-Bradley PowerFlex 700H AC drive series. This internal communication module serves as the primary gateway for integrating the drive into advanced control architectures, allowing for high-speed data exchange between the drive's firmware and external peripherals or network scanners.

By installing the 20C-DPI1 (20C-DPI1), users can leverage enhanced connectivity for digital and analog I/O expansion boards, facilitating complex motor control strategies. This module is essential for applications requiring precise parameter monitoring and remote drive configuration via the DPI protocol. Although Rockwell Automation officially moved this product to "Discontinued" status on June 1, 2023, it remains a critical spare part for maintaining the large installed base of PowerFlex 700H high-power drives.

Detailed Technical Specifications

The 20C-DPI1 is built to the following industrial automation standards:

• Manufacturer: Allen-Bradley (Rockwell Automation)

• Model Number: 20C-DPI1

• Series: PowerFlex 700H

• Module Type: DPI (Drive Peripheral Interface) Option Kit

• Supported I/O: Interfacing for 24V/115V Digital Inputs, Analog I/O, and Relay Outputs

• Internal Interface: DPI Architecture Class

• Mounting Type: Internal (Plug-in design to the drive's main control pod)

• Power Source: Supplied via the PowerFlex 700H internal bus

• Compatibility: Exclusively for PowerFlex 700H Frame Sizes

• Data Transfer Rate: Supports standard DPI baud rates for real-time parameter scaling

• Product Net Weight: 0.09 lbs (0.04 kg)

• Lifecycle Status: Discontinued (June 2023)

Core Performance Features

• Native DPI Integration: Provides seamless communication with HIM (Human Interface Modules) and network communication adapters (e.g., 20-COMM-E).

• Enhanced Field Connectivity: Acts as the necessary backbone for adding discrete and analog I/O expansion boards to the drive.

• Compact Footprint: Designed to fit within the existing drive enclosure without requiring additional panel space.

• High-Speed Parameter Access: Allows for the transmission of critical drive status data including current, torque, and fault diagnostics to supervisory controllers.

• Rugged Reliability: Built to handle the high-thermal and EMI environments found within high-power AC drive cabinets.