ABB DSBB175 Advant Master Backplane Modules
Manufacturer: ABB
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Part Number: DSBB175
Condition：New with Original Package
Product Type: Bus Backplane Modules
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Country of Origin: Sweden
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
ABB DSBB175 Advant Master MXB Bus Backplane Module
The ABB DSBB175, also cataloged as the DSBB175 MXB Bus Backplane Module, operates as a dedicated hardware component for high-speed signal routing and internal supply rails within Advant Master and MasterPiece 200/200/1 control systems.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | DSBB175 (57310256-ER) |
| Brand | ABB |
| Origin | Switzerland |
| Weight | 1.2 kg |
| Dimensions | 240 x 180 x 80 mm |
| Operating Temp | -10 to +60 deg C |
| Power Consumption | Passive backplane bus routing layout |
| Bus Architecture | MXB Bus Interface |
| Compliance | CE, RoHS |
| System Compatibility | ABB Advant Master, MasterPiece 200/200/1 |
Backplane Bus Communication Velocity & I/O Density Scaling
The DSBB175 establishes parallel physical conduits that optimize backplane bus communication velocity across populated rack slots. Controlled microstrip routing limits cross-talk and transmission reflections during high-frequency data exchanges between main processor cards and connected communication nodes. This physical layer stability supports aggressive I/O density scaling without degrading deterministic control loops or corrupting firmware flash compatibility checks across node updates.
Frequently Asked Questions
Q: How does the DSBB175 ensure backplane signal integrity during high module loading?
A: The board utilizes matched-impedance trace geometries and integrated bus termination paths to suppress signal reflections and preserve deterministic data timing as module count increases across the rack.
Q: Can modules be inserted or removed from the DSBB175 backplane while the rack is energized?
A: Hot-swapping depends on the underlying system architecture; field personnel must verify that the specific CPU and I/O sub-modules mounted on the DSBB175 support live insertion before removing hardware to prevent bus errors.
Field Installation Guidelines
Mount the DSBB175 backplane assembly vertically into the enclosure sub-rack using standard structural fasteners, ensuring all grounding contact points make metal-to-metal contact with the panel frame. Route field interface and power distribution cables through dedicated wire ways to avoid mechanical strain on the backplane connectors. Verify that the ambient operating environment remains within -10 to +60 deg C and maintain unobstructed airflow paths across the rack to facilitate passive heat evacuation.