Allen-Bradley 1769-L24ER-QB1B CompactLogix Embedded I/O CPU Controller
Manufacturer: Allen Bradley
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Part Number: 1769-L24ER-QB1B
Condition：New with Original Package
Product Type: CPU Processors
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Allen-Bradley 1769-L24ER-QB1B CompactLogix 5370 Controller
Configured for integrated discrete and analog signal execution in CompactLogix 5370 automation networks, the Allen-Bradley 1769-L24ER-QB1B (1769-L24ER-QB1B CompactLogix Controller) provides direct physical/electrical execution. The hardware assembly processes control logic across 32 independent tasks, coordinates up to 4 motion axes over industrial networks, and drives local expansion channels via a unified backplane interface. Dual integrated Ethernet ports execute Device Level Ring (DLR) protocols to maintain execution continuity during physical network link disruptions.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 1769-L24ER-QB1B |
| Brand | Allen-Bradley |
| Origin | USA |
| Weight | 0.91 kg |
| Dimensions | Standard CompactLogix 5370 chassis footprint |
| Operating Temp | 0 to +60 deg C |
| Storage Temp | -40 to +85 deg C |
| Power Consumption | 12 W maximum power dissipation |
| Input Power Voltage | 24 VDC isolated embedded power supply |
| Backplane Current Capacity | 1.0 A @ 5 VDC local expansion bus limit |
| Internal Current Draw | 1.54 A @ 5 VDC / 0.95 A @ 24 VDC |
| User Memory | 750 KB to 1 MB application allocation |
| Embedded Digital I/O | 14 digital inputs (24 VDC) / 10 digital outputs (24 VDC) |
| Embedded Analog I/O | 2 analog inputs (voltage/current) / 2 analog outputs |
| Local Expansion Capacity | Up to 4 local 1769 Compact I/O modules |
| Network Interfaces | 2 x 10/100 Mbps Ethernet ports / 1 x USB 2.0 interface |
| Motion Axes | Up to 4 axes via CIP Motion over EtherNet/IP |
| Isolation Voltage | 30 V continuous insulation boundary |
| Certifications | CE, UL, CSA, IECEx, ATEX |
Deterministic Network Routing and I/O Density Scaling
The processing unit utilizes an EtherNet/IP deterministic network architecture to manage real-time I/O density scaling alongside motion synchronization via CIP Sync. The embedded hardware configuration combines discrete logic blocks, analog loops, and high-speed counting circuits into a single physical block, limiting the required footprint inside the electrical cabinet. System variables match firmware flash compatibility profiles within Studio 5000 Logix Designer software, ensuring that time-critical application data maintains predictable backplane bus communication velocity across both embedded channels and local 1769 expansion modules.
Frequently Asked Questions
Q: What are the exact structural configuration limits for expanding local hardware channels?
A: The embedded backplane driver permits a maximum expansion of 4 local 1769 Compact I/O modules directly attached to the right side of the controller chassis.
Q: How does the controller respond to a hardware ring break on the network ports?
A: The integrated dual ports implement native Device Level Ring (DLR) topology, which automatically detects the physical media fault and reroutes standard IP and CIP Motion packets within milliseconds without shifting the processor into a fault state.
Q: What input power is required to drive the internal electronics and backplane bus?
A: The hardware operates from an isolated 24 VDC external input source connected directly to the embedded power terminals, drawing up to 1.54 A @ 5 VDC for internal rail utilization.
Field Installation Guidelines
- Grounding Continuity: Secure the integrated chassis ground lug directly to a clean, unpainted section of the DIN rail or backpanel to ensure proper drainage of common-mode electrical noise.
- Backplane Current Verification: Calculate the total 5 VDC current requirements of the selected local expansion modules to confirm the cumulative load does not exceed the 1.0 A local expansion bus limit.
- Thermal Airflow Management: Install the hardware assembly in a horizontal orientation, providing at least 50 mm of open space above and below the module cooling vents to ensure natural convection cooling.