Allen-Bradley 1769-L36ERM CompactLogix 5370 1.5MB Motion Controller
Manufacturer: Allen Bradley
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Part Number: 1769-L36ERM
Condition：New with Original Package
Product Type: CPU Processors
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Allen-Bradley 1769-L36ERM CompactLogix 5370 Controller
The Allen-Bradley 1769-L36ERM serves as the primary 1769-L36ERM CPU Processor utilized to execute central execution logic, dual-port networking protocols, and multi-axis synchronization across CompactLogix 5370 platform networks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 1769-L36ERM |
| Brand | Allen-Bradley / Rockwell Automation |
| Origin | USA |
| Module Type | CompactLogix 5370 Ethernet/IP Controller |
| User Memory | 1.5 MB (data and program storage) |
| Local I/O Expansion Capacity | Up to 30 local 1769 I/O modules |
| Ethernet Communication | 2 x 10/100 Mbps RJ45 ports |
| Integrated Motion Axis Limits | Up to 16 motion axes over EtherNet/IP |
| Local Backplane Current Load | 1.0 A at 5 VDC |
| Programming Interfaces | 1 x USB 2.0 peripheral port |
| Isolation Voltage | 30 V continuous (Basic Insulation), tested at 500 V AC for 60 s |
| Power Dissipation, Max | 4.5 W |
| Embedded Power Supply Options | 1769-PA2, 1769-PB2, 1769-PA4, 1769-PB4 |
| Module Width | 55.00 mm (2.17 in) |
| Panel-Mounting Screw Torque | 1.1 to 1.8 N-m (10 to 16 lb-in) using M4 or #8 screws |
| Weight | 2.0 kg net / 3.0 kg shipping |
| Operating Temp | 0 deg C to +60 deg C |
| Storage Temp | -40 deg C to +85 deg C |
| Relative Humidity | 5% to 95% RH, non-condensing |
EtherNet/IP Deterministic Networks and Firmware Flash Compatibility
The 1769-L36ERM controller utilizes integrated dual RJ45 ports to manage traffic over EtherNet/IP deterministic networks, enabling synchronous device-level ring (DLR), linear, and star topologies. Operators execute configuration updates and synchronize real-time motion commands using CIP Motion and CIP Sync variables mapped across a maximum threshold of 16 axes. System operations require strict firmware flash compatibility matching the target Studio 5000 Logix Designer project revision to ensure accurate scheduling over the 1.0 A backplane bus. The 1.5 MB internal memory structure stores compiled routines while the processing engine maintains localized diagnostic registers to track hardware failures without extending cycle time latencies.
Frequently Asked Questions
Q: Does the 1769-L36ERM support the modification or replacement of local I/O modules while the system backplane is energized?
A: No. The local 1769 bus design lacks Online Insertion and Removal (RIUP) capability. System developers must fully isolate all incoming power lines from the local 1769 power supply before adding or removing any expansion modules to prevent hardware damage.
Q: How do the two integrated Ethernet ports handle network traffic and addressing configuration?
A: The dual interfaces link to an internal three-port real-time switch and share a single physical MAC and IP address. The hardware configuration passes DLR redundancy packets through the media link layers directly, avoiding the need for individual IP allocations per port.
Field Installation Guidelines
- Chassis Assembly: Guide the processor onto a standard 35 mm symmetric DIN rail or lock it directly to a metallic enclosure backplate using M4 or #8 screws torqued precisely between 1.1 and 1.8 N-m. Ensure all local expansion bus slide locks secure firmly into the adjacent I/O modules.
- Grounding Protocols: Secure a dedicated low-impedance copper strap from the central power supply ground terminal directly to the functional earth panel ground bar to guard internal logic states against electrical transients.
- Network Wiring: Deploy shielded Category 5e minimum twisted-pair cabling conforming to TIA 568 B.1 specifications for all EtherNet/IP linkages. Run communication cables inside isolated metal conduits away from high-voltage AC motor distribution blocks.
- Thermal Envelope: Maintain clear ventilation zones measuring a minimum of 50 mm above and below the module framework to facilitate natural air convection and prevent the internal core temperature from exceeding the 60 deg C operational threshold.