Allen-Bradley 1769-OV32T Sinking Digital Output Module
Manufacturer: Allen Bradley
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Part Number: 1769-OV32T
Condition：New with Original Package
Product Type: Digital Output Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Allen-Bradley 1769-OV32T CompactLogix Digital Output Module
The Allen-Bradley 1769-OV32T, also cataloged as the 1769-OV32T Digital Output Module, operates as a dedicated hardware component for solid-state discrete signal execution within CompactLogix and MicroLogix 1500 network architectures. The hardware provides 32 current-sinking points configured to switch 24 VDC control circuits for field actuators, relays, and solenoids. Operating via the 1769 system bus, the module processes logical state arrays from the controller core and establishes direct electrical paths to ground, sinking current from load devices through an open enclosure configuration.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 1769-OV32T SER A |
| Brand | Allen-Bradley |
| Origin | Standard Factory Sourced |
| Weight | 0.50 lbs (0.23 kg) |
| Dimensions | 118 x 35 x 87 mm |
| Operating Temp | 0 deg C to 60 deg C |
| Power Consumption | Standard 1769 backplane bus drawing limits |
| Output Channels | 32 points (grouped in two sets of 16) |
| Output Type | 24 VDC sinking (solid-state, low true) |
| Voltage Range | 10.2-26.4 VDC |
| Current per Output | Max 0.5 A |
| Current per Module | Max 4.0 A |
| Wire Type | Copper-90 deg C solid or stranded |
| Solid Wire Size | 22-14 AWG |
| Stranded Wire Size | 22-16 AWG |
Backplane Bus Communication Velocity and EtherNet/IP Deterministic Networks
The discrete interface routes data frames across the internal 1769 system bus to sync I/O logic states with the central processing unit cycle. Maintaining proper slot positioning preserves backplane bus communication velocity and prevents timing delays within downstream Profinet / EtherNet/IP deterministic networks. The high-density 32-point structure requires balanced current load distribution across the backplane connection interface, remaining within system electrical thresholds. System engineers must cross-check firmware flash compatibility variables when using this module alongside network adapters like the 1769-AENTR or 1769-ADN, ensuring that the 32-point configuration parameters match the active hardware profiles.
Frequently Asked Questions
Q: Can this high-density module be hot-swapped while the 1769 chassis is powered?
A: No. The CompactLogix 1769 platform lacks support for Removal and Insertion Under Power (RIUP). Pulling or inserting the module during backplane power execution creates current spikes that damage the solid-state sinking circuits and cause host CPU faults.
Q: What are the consequences of exceeding the 4 A current limitation across the module?
A: Exceeding the max module current rating of 4 A causes thermal stress within the internal switching circuits. While individual channels handle up to 0.5 A, overloading the common terminals degrades the internal trace structure, leading to permanent hardware failure.
Field Installation Guidelines
- Bus Alignment and Mechanical Interlock: Align the side tongue-and-groove slots to guide the module into the adjacent unit. Slide the upper and lower bus levers forward to close the electrical backplane connections. Secure the mechanical latches fully before energizing the system.
- DIN-Rail Assembly and Panel Mounting: Secure the open-enclosure hardware onto an EN 50022 compliant 35 mm DIN rail or fasten it to the sub-panel using the pull-out tabs. The installation site must maintain an environment rated for Pollution Degree 2, avoiding dust, static discharge, and direct UV radiation.
- Discrete Wiring Separation and Shielding: Terminate field loops using 90 deg C copper wire (22-14 AWG solid or 22-16 AWG stranded). Route the 24 VDC sinking signal lines away from high-voltage AC motor conductors to avoid inductive coupling. Ground all cable shields at a single panel termination rail.