Allen-Bradley 1769-PB2 CompactLogix Power Supply Module
Manufacturer: Allen Bradley
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Part Number: 1769-PB2
Condition：New with Original Package
Product Type: Power Supply Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Allen-Bradley 1769-PB2 Compact I/O Power Supply Module
Configured for direct physical/electrical execution in 1769 system enclosures, the Allen-Bradley 1769-PB2 (1769-PB2 Power Supply Module) provides direct physical/electrical execution. It accepts a nominal 24 VDC input and supplies regulated power directly to the internal backplane bus for local I/O connection banks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 1769-PB2 |
| Brand | Allen-Bradley |
| Origin | USA |
| Weight | 0.75 lbs (0.34 kg) |
| Dimensions | Standard 1769 Module Width |
| Operating Temp | 0 to +60 deg C |
| Power Consumption | ~2.8 A @ 24 VDC Nominal |
| Input Voltage Range | 19.2 to 31.2 VDC |
| Backplane Current Output | 5 VDC @ 4 A and 24 VDC @ 2.8 A |
| Isolation Voltage | 1500 V between input and backplane, 75 V continuous reinforced insulation |
| Fault Protection | Overcurrent, short-circuit, and thermal shutdown |
| Wire Specification | 14 AWG solid copper wire rated for 90 deg C minimum |
| Wire Insulation | 1.2 mm maximum thickness |
| Compatibility | CompactLogix (1768/1769), MicroLogix 1500 platforms |
| Enclosure Type | None (Open Enclosure) |
| Certifications | CE, UL, CSA |
Deterministic Network Architecture
The power supply module maintains backplane bus communication velocity by stabilizing the voltage lines against sudden current spikes caused by concurrent I/O transitions. Internal circuit architecture utilizes firmware flash compatibility verifications to regulate current allocation across the expansion chassis. High-density I/O density scaling relies directly on this module to maintain the required 5 VDC and 24 VDC rail balances, preventing communication drops across deterministic networks like EtherNet/IP or DeviceNet linked to the local controller bank.
Frequently Asked Questions
Q: Can this power supply module be placed at any position within the 1769 I/O chassis bank?
A: No, the 1769-PB2 serves as a bank-terminating power source or a primary system power supply. The hardware configuration limits placement to either the leftmost slot next to the controller or as an expansion bank starter node to feed the backplane lines.
Q: Does the 1769-PB2 support active replacement while the system is under electrical load?
A: No, this hardware platform lacks support for Removal and Insertion Under Power (RIUP). Operators must isolate the external 24 VDC source voltage before separating the wiring terminal or disconnecting the module to avoid continuous arc faults.
Field Installation Guidelines
- Bus Connection Alignment: Align the side-locking tongue-and-groove guides carefully when mating the power supply to adjacent 1769 modules. Move the upper and lower bus levers completely to the locked position to bridge the internal power lines securely.
- Terminal Block Wiring: Use 14 AWG solid copper wire with a temperature rating of 90 deg C or higher for the main 24 VDC input. Ensure the wire insulation thickness does not exceed 1.2 mm to match the terminal clamp tolerances.
- Chassis Grounding Structure: Connect the internal grounding terminal directly to the enclosure frame or a dedicated copper grounding bar using the shortest possible wire run to maximize surge voltage dissipation capabilities.