Allen-Bradley 1769sc-IF8U 8-Channel Universal Analog Module
Manufacturer: Allen Bradley
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Part Number: 1769sc-IF8u
Condition：New with Original Package
Product Type: Analog Input Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Allen-Bradley 1769sc-IF8U CompactLogix Universal Analog Input Module
The Allen-Bradley 1769sc-IF8U serves as the primary 1769sc-IF8 Universal Analog Input Module utilized to execute multi-channel signal conversion and isolation across CompactLogix and MicroLogix 1500 platforms. The internal hardware framework incorporates a 16-bit analog-to-digital converter capable of acquiring inputs from up to eight voltage, current, or thermocouple channels, or up to four RTD and resistance sensors. Operating as a single-slot chassis component, the module provides programmable digital filtering alongside dedicated cold junction compensation to manage thermal sensor linearized offsets directly at the backplane interface boundary.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 1769sc-IF8U |
| Brand | Allen-Bradley |
| Origin | USA |
| Weight | 0.26 kg (0.56 lbs) |
| Dimensions | Single-slot standard 1769 width form factor |
| Operating Temp | 0 to +60 deg C |
| Power Consumption | Backplane current: 150 mA at 5 VDC, 45 mA at 24 VDC |
| Thermal Dissipation | Approximately 3 W |
| Channel Count | 8 analog inputs (V, I, TC) or 4 RTD/Resistance inputs |
| Input Resolution | 16-bit |
| Voltage Input Ranges | ±50 mV, ±100 mV, 0-5 V, 1-5 V, 0-10 V, ±10 V |
| Current Input Ranges | 0-20 mA, 4-20 mA |
| Resistance Ranges | 0-150, 0-1000, 0-3000 ohms |
| Thermocouple Types | J, K, T, B, E, R, S, N, C |
| RTD Sensor Types | PT385/3916, Ni618/672, NiFe518, Cu426 |
| Update/Sample Times | 0.30 s at 10 Hz, 0.63 s at 50 Hz, 0.53 s at 60 Hz, 0.15 s at 250 Hz, 0.07 s at 1000 Hz |
| Input Overvoltage Max | ±30 VDC continuous |
| Input Overcurrent Max | 28 mA continuous |
| Electrical Isolation | 10 VDC channel-to-channel, 500 VDC field-to-backplane, 500 VDC field-to-chassis |
| Input Impedance | Greater than 10 Mohms (Voltage/TC/RTD), Less than 250 ohms (Current) |
Industrial Control & Drive Features
The universal signal processing infrastructure interfaces with standard backplane bus communication velocity frameworks to assure high-density variable mapping across localized chassis systems. Operating within Profinet / EtherNet/IP deterministic networks governed by the master CPU, the module establishes individual configuration profiles per terminal point, expanding baseline I/O density scaling options within a single hardware footprint. Channel configurations, filter settings, and sensor calibration metrics match native firmware flash compatibility standards, enabling real-time open-circuit detection and boundary diagnostics to report directly to controller data tables.
Frequently Asked Questions
Q: How is the channel-to-channel electrical isolation rated on the 1769sc-IF8U?
A: The module provides an internal separation barrier rated at 10 VDC channel-to-channel isolation, accompanied by a higher 500 VDC dielectric protection rating between the field-side wiring and the backplane logic components.
Q: Does this universal module support hot-swapping or removal under active electrical power?
A: No, the 1769 platform mechanics do not natively accommodate online insertion and removal (RIUP). System backplane power must be completely isolated before extracting the unit to avoid corruption of execution memory.
Q: Can the 1769sc-IF8U scan all eight channels simultaneously when mixed with thermocouples and 4-20 mA loops?
A: Yes, the onboard conversion hardware dynamically sequences the enabled channels based on the assigned data filter frequency parameters (ranging from 5 Hz to 1000 Hz) designated via RSLogix 5000 parameters.
Field Installation Guidelines
Isolate the primary 1769 chassis backplane power supply and confirm the system is entirely de-energized before beginning installation. Align the module tongue-and-groove tracks carefully with the adjacent hardware slots and secure the assembly onto the 35 mm DIN rail or panel grid. Engage the integrated bus lever mechanism to close the backplane circuit pins firmly. Adhere strictly to the maximum power supply distance rating of 8 modules from the power source card. Terminate all sensor cabling using designated low-capacitance shielded twisted-pair (STP) conductors, maintaining physical segregation between low-voltage signal wires and high-voltage power leads. Ground the overall copper braid shield at a single low-impedance master earth point inside the cabinet panel, ensuring that the sensor shields are not grounded at both ends to prevent the formation of ground loops across the 16-bit measurement circuits.