Combination Digital I/O Module | Allen-Bradley 1769-IQ6XOW4
Combination Digital I/O Module | Allen-Bradley 1769-IQ6XOW4
Combination Digital I/O Module | Allen-Bradley 1769-IQ6XOW4
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Combination Digital I/O Module | Allen-Bradley 1769-IQ6XOW4

  • Manufacturer: Allen Bradley

  • Part Number: 1769-IQ6XOW4

  • Condition:New with Original Package

  • Product Type: Digital I/O Cards

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

Allen-Bradley 1769-IQ6XOW4 Compact I/O Digital Combination Module

The Allen-Bradley 1769-IQ6XOW4, also cataloged as the 1769-IQ6XOW4 Mixed Digital Input/Output Module, operates as a dedicated hardware component for discrete signal acquisition and electrical contact execution within CompactLogix control networks.

Hardware Specifications

Parameter Specification
Model 1769-IQ6XOW4
Brand Allen-Bradley / Rockwell Automation
Origin United States
Module Type Compact I/O Mixed Digital Input/Output Module
Inputs 6 digital inputs (24 VDC Sink/Source)
Input Voltage Range 10-30 VDC (Nominal 24 VDC)
Off-State Voltage, Max 11 VDC
Input Current 8 mA per channel
Outputs 4 relay outputs (Form A contacts)
Output Voltage Range 5-125 VDC, 5-265 VAC
Output Current Rating 2 A per channel max (resistive load)
Current Draw at 5.1V 105 mA nominal (~150 mA max backplane draw)
Current Draw at 24V 50 mA nominal (~120 mA max backplane draw)
Heat Dissipation, Max 2.75 W
Isolation Voltage 1500 V between input, output, and backplane bus
Power Supply Distance Rating 8 modules
Replacement Terminal Block 1769-RTBN18 (18-point terminal)
Wire Type Copper rated at 90 deg C
Weight 0.20 kg (0.44 lbs) net / 1.5 kg shipping
Operating Temp 0 deg C to +60 deg C
Storage Temp -40 deg C to +85 deg C
Relative Humidity 5% to 95% RH, non-condensing
System Compatibility CompactLogix (1768/1769 series), MicroLogix 1500

Backplane Bus Communication and Deterministic Scaling

The 1769-IQ6XOW4 module routes discrete data frames across the internal CompactLogix chassis through deterministic backplane bus communication velocity channels. The embedded circuitry updates the input image table and transfers command bits to the physical relay output coils within fixed microprocessor update intervals. High density scaling is achieved by combining distinct input sensing logic and output contact mechanisms onto a single slot footprint, optimizing the 8-module power supply distance allocation. The 1500 V physical isolation boundary prevents field-side electrical surges or ground noise spikes from penetrating the backplane bus, securing data transfer accuracy under continuous duty cycles.

Frequently Asked Questions

Q: Can this combination module be hot-swapped or replaced while the system backplane is energized?

A: No. The local 1769 bus framework does not support live insertion or removal. Operators must turn off the primary system power supply before seating or unseating the module to prevent electrical arcing and logic failures.

Q: What is the mechanical life expectancy and speed constraint of the integrated relay contacts?

A: The module relies on electromechanical Form A relay components. Due to physical coil movement and contact wear, switching frequencies are governed by mechanical response limits, making them unsuitable for high-speed pulse train outputs.

Field Installation Guidelines

  • Chassis Attachment: Install the module onto a grounded 35 mm DIN rail or bolt it firmly to a metal backpanel. Slide the bus extension connector into the adjacent slot until the module locking mechanism snaps completely into place.
  • Terminal Wiring: Connect field wiring using the 1769-RTBN18 terminal block. Utilize 90 deg C rated copper conductors, keeping signal wires distinct from high-voltage motor distribution paths to prevent inductive noise.
  • Relay Protection: Deploy external surge suppression circuits, such as varistors or RC networks for inductive AC loads, and flyback diodes for DC loads, to prevent contact degradation at the relay outputs.
  • Thermal Management: Provide a minimum 50 mm space envelope above and below the chassis for ambient air flow, ensuring operating conditions do not exceed the 60 deg C threshold.
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