CPU Processor Module | GE IC695CPU315-BB PACSystems RX3i
CPU Processor Module | GE IC695CPU315-BB PACSystems RX3i
CPU Processor Module | GE IC695CPU315-BB PACSystems RX3i
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CPU Processor Module | GE IC695CPU315-BB PACSystems RX3i

  • Manufacturer: GE Fanuc

  • Part Number: IC695CPU315-BB

  • Condition:New with Original Package

  • Product Type: CPU Processors

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE IC695CPU315-BB PACSystems RX3i CPU Module

Configured for Specific Technical Task in System/Network Name, the GE IC695CPU315-BB (IC695CPU315 CPU Module) provides direct physical/electrical execution. The hardware operates as a central processing unit executing control logic and data manipulation over the embedded RX3i backplane infrastructure.

Hardware Specifications

Parameter Specification
Model IC695CPU315-BB
Brand GE Fanuc / Emerson
Origin USA
Weight 0.2 kg (module only)
Dimensions 241 x 194 x 152 mm
Operating Temp 0 to +60 deg C
Power Consumption +5 VDC at approx. 0.8 A
Processor Intel Celeron-M microprocessor, 1 GHz
Architecture 32-bit
Memory Large user memory and flash storage (configurable)
Execution Speed High-speed Boolean execution
Communication Interfaces 1 x Ethernet port (RJ-45), RS-232 / RS-485 serial ports, RX3i PCU bus
Programming Support Ladder logic, Structured Text, C language
Storage Temperature -40 to +85 deg C
Humidity 5% - 95% non-condensing
Mounting Single-slot RX3i rack installation

Industrial Control and Deterministic Network Operations

The control hardware employs specialized backplane bus communication velocity parameters to synchronize multi-rack system Topologies. Deterministic data transmission over industrial networks utilizes embedded Profinet or EtherNet/IP protocols to execute time-critical synchronization routines. Firmware flash compatibility rules require consistent microcode versions across both active and redundant backup processing nodes. The hardware layer enforces physical network isolation through dedicated MAC addressing structures, managing high I/O density scaling profiles without degradation of standard cyclic task schedules or execution jitter loops.

Frequently Asked Questions

Q: What is the exact current allocation required from the backplane power supply?

A: The unit demands a typical current draw of approximately 0.8 A from the +5 VDC backplane bus rail during nominal operation. System power budgets must account for this load alongside adjacent I/O infrastructure.

Q: Which programming languages are supported for logic execution on this hardware?

A: The processor executes control logic written in Ladder Logic, Structured Text, and C languages compiled for the PACSystems RX3i architecture.

Field Installation Guidelines

Ensure total system power is isolated before inserting or removing the hardware from the PACSystems RX3i backplane chassis. Align the module with the designated single-slot chassis guides and press firmly until the top and bottom connectors fully engage the backplane receptacle. Secure the module using the integral chassis retention mechanisms to minimize mechanical vibration anomalies. Grounding integrity requires clean metal-to-metal contact between the module frame and the grounded chassis enclosure. All field communications wiring, including the RS-232/RS-485 serial links and the RJ-45 Ethernet cable, must use industrial-grade shielded twisted pair (STP) cabling. Route low-voltage communication paths physically separated from high-voltage AC/DC power conductors to mitigate electro-magnetic interference limits.

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