DI216 Bachmann Digital Input Module | New & Original Stock
Manufacturer: Bachmann
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Part Number: DI216
Condition：New with Original Package
Product Type: Digital Input Modules
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Country of Origin: Austria
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Bachmann DI216 Digital Input Module
The Bachmann DI216, also cataloged as the DI216 Digital Input Module, operates as a dedicated hardware component for discrete sensor state acquisition within Bachmann M1 platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | DI216 |
| Brand | Bachmann |
| Origin | Austria |
| Weight | 0.35 kg |
| Dimensions | 130 mm x 25 mm x 150 mm |
| Operating Temp | -30 to +60 deg C |
| Power Consumption | 3 W |
| Channel Density | 16 digital input channels |
| Nominal Voltage | 24 VDC |
| Voltage Input Range | 18-34 VDC continuous operational window |
| Input Current Load | 2 to 3 mA per channel |
| Galvanic Isolation | Channel-to-system boundary up to 1500 V RMS |
| Hardware Response Time | < 5 ms |
| Status Monitoring | Per-channel LED matrix and integrated self-diagnostics |
| Storage Temperature | -40 to +85 deg C |
| Humidity Environment | 5% to 95% RH, non-condensing |
Profinet / EtherNet/IP Deterministic Networks and I/O Density Scaling
The DI216 processes 16 binary signal channels concurrently, funneling the raw sensor data directly into the central execution register via the internal backplane bus communication velocity link. This integration path matches structural processing loops found in Profinet / EtherNet/IP deterministic networks, ensuring that high-speed transitions remain locked to sub-millisecond execution tasks. The module enables high-density local I/O density scaling inside the M1 rack configuration, checking signal variables continuously against firmware flash compatibility parameters during hot-insertion cycles. A 1500 V RMS electrical barrier isolates the backplane electronics from field circuit feedback loops.
Frequently Asked Questions
Q: What are the continuous electrical limitations and risk constraints when executing hot-swap exchanges on the DI216 module?
A: The module supports live physical insertion and extraction from an active backplane structure. However, doing so immediately de-energizes the 16 binary signal paths, which can generate trace exceptions in active program tasks if input data states are not properly forced or bypassed in the system registers beforehand.
Q: How does the internal state register filter high-frequency contact bounce on the 18-34 VDC inputs?
A: The onboard hardware circuit implements a fixed hardware low-pass input filter that keeps the total response latency under 5 ms. This prevents erratic mechanical switch bounce from registering as multiple execution triggers, maintaining system consistency within the defined operational firmware matrix.
Field Installation Guidelines
- Chassis Alignment and Rail Anchoring: Seat the module housing firmly into the standard symmetric steel DIN rail framework. Ensure that the integrated chassis ground fingers forge clean, unpainted contact with the metal rail to provide a functional path for electrical discharge.
- Vertical Convective Thermal Spaces: Leave a clear horizontal and vertical spatial boundary of at least 50 mm above and below the module framing to maintain unhindered convective airflow, keeping the environment below the +60 deg C operating threshold.
- Field Wiring Routing Separations: Route all 24 VDC signal wiring inside dedicated wire ways. Keep these low-voltage lines separated from parallel high-voltage AC mains or motor drive cables by a minimum of 300 mm to suppress transient electromagnetic coupling.
- Shield Terminal and Conductor Termination: Trim and terminate all field conductors using matching insulated ferrules. For lines subjected to high noise levels, clamp the cable shields directly to the cabinet ground bar, ensuring single-point grounding layout principles are followed.