Digital Output Modules | GE IC693MDL940K Series 90-30
Digital Output Modules | GE IC693MDL940K Series 90-30
Digital Output Modules | GE IC693MDL940K Series 90-30
/ 3

Digital Output Modules | GE IC693MDL940K Series 90-30

  • Manufacturer: GE Fanuc

  • Part Number: IC693MDL940K

  • Condition:New with Original Package

  • Product Type: Digital Output Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Fanuc IC693MDL940K Series 90-30 Output Module

Configured for discrete AC/DC load switching in Series 90-30 PLC systems, the GE Fanuc IC693MDL940K (IC693MDL940 Relay Output Module) provides direct physical/electrical execution.

Hardware Specifications

Parameter Specification
Model IC693MDL940K
Brand GE Fanuc
Origin USA
Weight 0.3 kg (0.68 kg packed)
Dimensions 3.5 x 13.0 x 13.5 cm
Operating Temp 0 to 60 deg C baseline
Power Consumption 7 mA from +5 VDC bus; 135 mA from +24 VDC relay bus (all outputs ON)
Output Count 16 points (Normally Open, arranged in 4 isolated groups of 4)
Operating Voltage 5-30 VDC, 5-250 VAC (50/60 Hz)
Maximum Load 2 A per point, 4 A per common, 16 A total per module
Inrush Current Limit 5 A maximum
Response Time 15 ms ON / 15 ms OFF maximum
Galvanic Isolation 1,500 V field-to-logic side; 500 V group-to-group

Backplane Bus Dynamics & I/O Isolation Profiles

The module interfaces directly with the backplane bus communication velocity Licences of the Series 90-30 rack, using a dual power rail mechanism. Logic states pass across opto-couplers providing 1,500 V isolation to protect backplane electronics from field-side voltage transients. High relay packing density enables discrete control across four distinct potential groups. Integrated LED logic indicators monitor real-time contact states on the front panel, while the mechanical contact array enforces clean galvanic break characteristics during load shedding procedures.

Frequently Asked Questions

Q: Can maintenance personnel perform hot-swap replacement on this module while the system baseplate remains energized?

A: Hot-swapping is strictly prohibited. Inserting or removing the module under backplane power risks mechanical relay contact arcing and backplane circuit degradation.

Q: What protective measures prevent contact welding caused by inductive load kickback?

A: The module lacks internal suppression fuses. Installers must connect external metal oxide varistors (MOVs) across AC loads or flyback diodes across DC inductive coils.

Q: How does the current draw scale when multiple output relays energize simultaneously?

A: Each activated relay coil consumes additional power from the external +24 VDC relay power bus on the backplane, scaling up to a 135 mA peak when all 16 points energize concurrently.

Field Installation Guidelines

  1. Power Disconnection: De-energize the PLC rack power supply and field load circuits before seating the module into any available 5-slot or 10-slot baseplate I/O slot.
  2. Terminal Wiring: Route incoming field wiring through the removable terminal block, observing the red color-coded side insert that identifies high-voltage potential.
  3. Current Allocation Limits: Ensure continuous field load currents do not exceed 2 A per point or 4 A per common terminal wire to prevent thermal overload of internal traces.
  4. Inductive Load Suppression: Install external fast-acting fuses rated for specific field devices to safeguard individual outputs against overcurrent short circuits.
  5. Conduit Separation: Route low-voltage DC signals and high-voltage AC load lines in isolated raceways, maintaining a 30 cm minimum clearance gap to avoid electromagnetic crosstalk.
You may also like