DIO280 Bachmann M1 Series Datasheet & Technical Manual
DIO280 Bachmann M1 Series Datasheet & Technical Manual
DIO280 Bachmann M1 Series Datasheet & Technical Manual
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DIO280 Bachmann M1 Series Datasheet & Technical Manual

  • Manufacturer: Bachmann

  • Part Number: DIO280 00019114-00

  • Condition:New with Original Package

  • Product Type: Digital Input/Output Modules

  • Country of Origin: Austria

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

Bachmann DIO280 Digital Input/Output Module

The Bachmann DIO280, also cataloged as the DIO280 Digital Input/Output Module, operates as a dedicated hardware component for high-density signal routing within Bachmann M1 automation system platforms.

Hardware Specifications

Parameter Specification
Model DIO280
Brand Bachmann
Origin Austria
Weight 0.55 kg
Dimensions 130 mm x 50 mm x 150 mm
Operating Temp -30 to +60 deg C
Power Consumption 8 to 10 W
Channel Configuration 32 Digital Inputs + 32 Digital Outputs (64 points total)
Supply Voltage Window 18-34 VDC (Reverse polarity protected)
Input Circuit Threshold 24 VDC nominal, 2 to 3 mA per channel draw
Output Drive Capacity 24 VDC nominal, up to 0.5 A per channel continuous
Galvanic Isolation Up to 1500 V RMS electrical barrier limit
Propagation Latency Input: < 5 ms, Output: < 2 ms
Auxiliary Hardware 4 x 32-bit counters, 8 x interrupt inputs, PWM configuration
Diagnostics Per-channel LED state array and system monitoring bits
Storage Temp -40 to +85 deg C
Humidity Boundaries 5% to 95% RH, non-condensing

Profinet / EtherNet/IP Deterministic Networks and I/O Density Scaling

The DIO280 executes real-time binary synchronization across 64 continuous data channels, transferring state bits to the internal bus architecture via high-speed backplane communication routines. This parallel execution paradigm aligns with performance parameters demanded by Profinet / EtherNet/IP deterministic networks, ensuring low-latency data replication across complex process control networks. The architecture enables tight local I/O density scaling by supporting 4 configurable 32-bit hardware counters and 8 edge-triggered interrupt lines directly at the hardware layer. Pulse Width Modulation (PWM) subroutines can be flagged inside the firmware matrix to manage valve economy modes, limiting output current via an adjustable 0 to 2 s hold-time profile after initial activation.

Frequently Asked Questions

Q: What are the explicit electrical and backplane limits when executing hot-swap module replacements on a running Bachmann M1 rack?

A: The DIO280 incorporates hot-swappable line logic, allowing active extraction and insertion without removing system backplane power. During a live swap, the 32 discrete output circuits drop to a de-energized state within 2 ms, requiring upstream application tasks to handle or force interlock loops to prevent diagnostic timing faults.

Q: How does the PWM valve economy mode function mechanically to restrict continuous thermal dissipation?

A: When a channel is configured for PWM economy operation, the module delivers full 24 VDC output during the initial 0 to 2 s hold-time window to seat the solenoid armature. Once this period expires, internal logic scales down the duty cycle via PWM modulation, reducing power consumption and keeping module temperatures within the -30 to +60 deg C specification.

Field Installation Guidelines

  • DIN Rail Sub-Assembly Grounding: Hook the module onto a standard symmetric steel DIN rail. Verify that the rear ground contact points scratch through any oxidation or surface layer to establish solid, unpainted metal contact with the earth plane.
  • Solenoid Cable Separations: Route all 32 external output drive lines inside separate cable channels. Keep these lines at least 300 mm away from variable frequency drive motor cables or high-voltage AC mains to avoid induced inductive noise spikes.
  • Terminal Ring or Ferrule Dressing: Strip and crimp all field wiring conductors using matching insulated industrial ferrules before locking them into the terminal block assembly to prevent accidental loose-wire short circuits.
  • Thermal Boundary Clearances: Maintain an open horizontal and vertical space of at least 50 mm above, below, and around the module housing to allow natural air convection, ensuring internal temperatures stay below +60 deg C.
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