DS200TBCAG1A GE Mark V RTD Terminal Boards
Manufacturer: GE Fanuc
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Part Number: DS200TBCAG1A
Condition：New with Original Package
Product Type: Terminal Boards
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE DS200TBCAG1A Mark V RTD Terminal Board
Configured for high-accuracy temperature acquisition in Mark V automation platforms, the GE DS200TBCAG1A (DS200TBCAG1A RTD Terminal Board) provides direct physical/electrical execution. This hardware component routes low-level thermal resistance signals from field-mounted platinum, nickel, and copper RTD sensors directly into the internal processing architecture of Speedtronic control systems. The board conditions multi-channel 3-wire RTD signals, converting thermal variation into logical voltage values across turbine bearing, exhaust, and auxiliary monitoring loops without introduced transmission phase lag.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | DS200TBCAG1A |
| Brand | GE |
| Origin | United States (USA) |
| Weight | 0.5 kg |
| Dimensions | 33.0 cm x 17.8 cm |
| Operating Temp | -30 to +65 deg C (Standard Mark V enclosure rating) |
| Power Consumption | Low-power passive termination driven via backplane |
| Module Type | RTD Termination / Analog Input Terminal Board |
| Supported Sensors | Platinum (PT100, PT1000), Nickel (120 ohm), Copper (10 ohm) |
| Sensor Configuration | 3-wire RTD channels |
| Measurement Range | -200 to +600 deg C (sensor-dependent) |
| Measurement Accuracy | +/- 1 deg C typical |
| Status Indicators | Board LEDs for power, channel activity, and faults |
Backplane Bus Communication Velocity and Firmware Flash Compatibility
The DS200TBCAG1A interfaces directly with the internal bus structure of the Mark V core, preserving high backplane bus communication velocity across simplex, dual, and triple-redundant architectures. Onboard EMI/RFI filtering arrays condition raw analog voltages before transmitting signals over the backplane bus, maintaining deterministic frame execution during transient electrical events. A firmware flash compatibility interface within the master core allows synchronized register mapping, ensuring consistent execution and channel diagnostics across various Mark V and EX2000 revisions.
Frequently Asked Questions
Q: What specific sensor types and channel configurations are supported by the DS200TBCAG1A termination board?
A: The board interfaces with 3-wire RTD configurations, supporting platinum (PT100, PT1000), nickel (120 ohm), and copper (10 ohm) RTD elements across a measurement envelope of -200 to +600 deg C.
Q: Can the DS200TBCAG1A terminal board be replaced while the turbine control panel remains energized?
A: No, field maintenance requires complete power isolation. De-energize the Mark V control rack before disconnecting terminal wiring or extracting the board to prevent arc flash across the backplane bus interface and avoid corrupting active register memory maps.
Q: How does the DS200TBCAG1A process RTD signals in triple modular redundant (TMR) control architectures?
A: The board divides individual RTD signal pathways across parallel hardware channels, fanning out conditioned analog outputs directly to the R, S, and T control cores to facilitate deterministic 2oo3 voting loops without signal degradation.
Field Installation Guidelines
Chassis Isolation and Power Suppression: Ensure all power feeds to the Mark V rack and field RTD excitation loops are completely de-energized prior to mounting or dismounting the terminal board.
Wiring and Shielding Protocols: Connect 3-wire RTD field conductors securely to the screw terminal blocks. Terminate all cable shields at the dedicated ground bar on the cabinet frame, maintaining physical separation between low-level RTD wiring and high-voltage AC power lines.
Mechanical Fastening: Secure the board firmly inside the enclosure rack using all specified mounting screw locations to establish a solid chassis ground path and ensure physical vibration resistance.