Emerson SE4026 VIM2 Modbus TCP EtherNet/IP Datasheet & Manual
Emerson SE4026 VIM2 Modbus TCP EtherNet/IP Datasheet & Manual
Emerson SE4026 VIM2 Modbus TCP EtherNet/IP Datasheet & Manual
/ 3

Emerson SE4026 VIM2 Modbus TCP EtherNet/IP Datasheet & Manual

  • Manufacturer: Emerson

  • Part Number: KJ2006X1-BK2 SE4026

  • Condition:New with Original Package

  • Product Type: Virtual I/O Modules

  • Country of Origin: Germany

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

Emerson SE4026 DeltaV Virtual I/O Module

The Emerson SE4026, also cataloged as the SE4026 Virtual I/O Module 2 (VIM2), operates as a dedicated hardware component for simulating DeltaV I/O cards and integrating Ethernet field devices within DeltaV S-series Distributed Control System platforms.

Hardware Specifications

Parameter Specification
Model SE4026
Brand Emerson
Origin USA
Weight 0.4 kg
Dimensions 4.1 cm x 19.9 cm x 14.0 cm
Operating Temp 0 to 60 deg C (32 to 140 deg F)
Power Consumption 1.4 A maximum current consumption at +5 VDC
Power Dissipation 5.0 W typical, 7.0 W maximum
User Memory 48 MB
Protocols Supported Modbus TCP, EtherNet/IP
Mounting Slot Right slot of 2-wide Power/Controller Carrier
Shock Resistance 10g, 1/2 sine wave for 11 ms
Vibration Resistance 1 mm peak-to-peak (5 to 16 Hz), 0.5g (16 to 150 Hz)
Relative Humidity 5% to 95% RH, non-condensing
Certifications CE

Channel-to-Channel Isolation and DCS Instrument Processing

The SE4026 maps virtual register images over high-speed Ethernet infrastructure to substitute for physical hardware layers during validation testing. The module establishes logical channel-to-channel isolation by dividing software-configured datasets into discrete network zones, keeping industrial automation protocols like Modbus TCP and EtherNet/IP separate. When handling processes that replicate 4-20 mA HART loop protocol parameters, the processor updates auxiliary device registers inside its 48 MB memory partition. This structural routing maintains deterministic scan times within the DeltaV S-series CPU, ensuring repeatable performance across simulation nodes.

Frequently Asked Questions

Q: How does the SE4026 module manage data synchronization with Mimic Simulation Software?

A: The module reads and writes configuration mapping tables through its primary Ethernet interface. Run-time simulation changes generated in the Mimic software environment write directly to the 48 MB user memory block, updating the DeltaV S-series controller using standard backplane I/O commands.

Q: What actions occur if the current draw on the controller carrier exceeds the 1.4 A maximum rating?

A: An integrated overcurrent diagnostic system monitors the +5 VDC power pins. If current consumption exceeds safe thresholds, the module drops its active network configurations and enters a fault state to protect the processing components on the 2-wide carrier.

Q: Is hot-swapping permitted for the SE4026 module inside an active S-series chassis?

A: Yes, the module hardware handles live insertion and removal routines when mounted in the designated right slot of the carrier. Because it is utilized for simulation and third-party integration, removing the unit will interrupt data exchange across the virtual I/O mapping layer but will not trip unlinked physical I/O loops.

Field Installation Guidelines

  • Carrier Slot Allocation: Insert the module strictly into the right slot of the DeltaV 2-wide Power/Controller Carrier. Press the housing squarely against the backplane until the top and bottom latch mechanisms lock into place.
  • Network Infrastructure Shielding: Connect all simulation and device networks using shielded category 5e or category 6 twisted-pair cables. Ground the external cable shield at the cabinet entry bulkhead plate to block high-frequency electromagnetic noise.
  • Separation of Communication Runs: Separate Ethernet lines running to the SE4026 from heavy 24 VDC or AC power tracks inside the panel wiring channels to reduce inductive interference on communication loops.
  • Thermal Convection Boundaries: Maintain an open border of at least 50 mm (2 inches) above, below, and in front of the carrier assembly to support continuous airflow, keeping module operating temperatures beneath the +60 deg C limit.
You may also like