EPSCPE100-ACAH Emerson RSTi-EP Datasheet & Technical Manual
EPSCPE100-ACAH Emerson RSTi-EP Datasheet & Technical Manual
EPSCPE100-ACAH Emerson RSTi-EP Datasheet & Technical Manual
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EPSCPE100-ACAH Emerson RSTi-EP Datasheet & Technical Manual

  • Manufacturer: Emerson

  • Part Number: EPSCPE100

  • Condition:New with Original Package

  • Product Type: CPU Processors

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

Emerson EPSCPE100-ACAH PACSystems RSTi-EP Standalone Controller

The Emerson EPSCPE100-ACAH, also cataloged as the EPSCPE100 PACSystems RSTi-EP Standalone Controller, operates as a dedicated hardware component for machine control, process automation, and edge computing within industrial automation networks. The unit executes compiled control strategies using an integrated System-on-Module (SoM) processor to maintain low-latency scanning across local and distributed I/O buses. By combining logic processing with hardware-level communication execution, the component routes discrete and analog variables without auxiliary network gateways.

Hardware Specifications

Parameter Specification
Model EPSCPE100-ACAH (Base Model: EPSCPE100)
Brand Emerson
Origin USA
Weight 0.38 kg (Standard standalone controller block mass)
Dimensions Compact RSTi-EP form factor enclosure
Operating Temp -40 to +70 deg C
Power Consumption Backplane logic draw driven by standard 24 VDC supply
Processor Integrated System-on-Module (SoM)
Memory 1 MB user memory
I/O Capacity 2K discrete I/O bits, 32K analog I/O words
Storage Interfaces MicroSD card slot, 1 x USB-A 2.0 port
Ethernet Interfaces 1 x 10/100 Mbps port, 1 x 3-port switch (10/100 Mbps)
Serial Interface 1 x RS-232 port
Protocols Supported PROFINET, Modbus TCP/IP, OPC UA, SRTP, EGD
Network Redundancy Media Redundancy Protocol (MRP)
Mounting DIN rail
Certifications CE, RoHS

Industrial Control & Drives Network Determinism

The hardware routing subsystem leverages integrated Ethernet switches to execute deterministic communication across Profinet and EtherNet/IP networks. The controller handles native multi-protocol concurrency, processing up to 8 distinct PROFINET field devices alongside 8 independent OPC UA client connections directly inside the firmware layer. Network ring architecture stability is governed via embedded Media Redundancy Protocol (MRP) logic, which manages recovery mechanisms and alters data routing paths under sub-millisecond constraints during physical network cable disruptions.

Frequently Asked Questions

Q: How is data storage managed during runtime diagnostic logging on the EPSCPE100-ACAH?

A: The controller utilizes its 1 MB internal user memory allocation for active application code. Extended diagnostics, application backups, and historical data logs are compiled and written directly to a standard flash card via the integrated MicroSD slot or directed out through the USB-A 2.0 interface.

Q: What are the routing capabilities of the dual Ethernet port interfaces?

A: The hardware contains one isolated 10/100 Mbps port alongside an independent 3-port unmanaged switch array. This division allows engineers to physically separate internal I/O scanning traffic from corporate network queries or OPC UA client connections.

Q: Does the firmware flash capability support mixed discrete and analog allocation changes?

A: Yes, the 2K discrete bits and 32K analog words are fully mapable across the system firmware. Memory partition tables are checked during firmware flash cycles to ensure memory boundaries remain aligned during runtime changes.

Field Installation Guidelines

  • DIN-Rail Grounding Stability: Snap the controller chassis firmly onto a standard symmetric DIN rail. Ensure the rear zinc-plated grounding clip establishes a scratch-free contact connection with the metal rail surface to divert high-frequency switching noise.
  • Profinet Segment Separation: Route all PROFINET and Modbus TCP/IP communication cables inside shielded twisted-pair (STP) Cat5e or Cat6 cables. Run these network lines perpendicular to AC motor drives and motor power cables to minimize inductive cross-talk.
  • Thermal Dissipation Boundaries: Maintain a clearance profile of at least 30 mm around the top, bottom, and sides of the physical housing. In deployments where cabinet temperatures approach +70 deg C, maintain adequate forced-air ventilation to stabilize internal SoM processor temperatures.
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