{"product_id":"extended-analog-i-o-board-ge-ds200tcqbg1bcb-mark-v","title":"Extended Analog I\/O Board | GE DS200TCQBG1BCB Mark V","description":"\u003ch2\u003eGeneral Electric DS200TCQBG1BCB Mark V RST Extended Analog I\/O Board\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eGeneral Electric DS200TCQBG1BCB\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eDS200TCQB\u003c\/strong\u003e RST Extended Analog I\/O Board, operates as a dedicated hardware component for analog and digital signal conditioning and I\/O expansion within GE Speedtronic Mark V turbine control systems.\u003c\/p\u003e\n\u003ch3\u003eSuffix Breakdown \u0026amp; Model Matrix\u003c\/h3\u003e\n\u003cp\u003eThe alphanumeric designation \u003cstrong\u003eDS200TCQBG1BCB\u003c\/strong\u003e breaks down according to GE Speedtronic manufacturing standards:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eDS200\u003c\/strong\u003e: Standard GE Speedtronic board class and base platform designator.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTCQB\u003c\/strong\u003e: RST Extended Analog I\/O Card functional architecture.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eG1\u003c\/strong\u003e: Group 1 manufacturing series grouping.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eB\u003c\/strong\u003e: Functional revision level identifier.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCB\u003c\/strong\u003e: Artwork layout modification revision code.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eDS200TCQBG1BCB\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGeneral Electric\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e1.1 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e267 mm x 216 mm x 38 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-30 deg C to +70 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStorage Temp\u003c\/td\u003e\n\u003ctd\u003e-40 deg C to +85 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e5 VDC from system backplane at 400 mA to 600 mA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePCB Coating\u003c\/td\u003e\n\u003ctd\u003eStandard (normal coating)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eIsolation Voltage\u003c\/td\u003e\n\u003ctd\u003e1500 V between I\/O and system circuitry\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBackwards Compatibility\u003c\/td\u003e\n\u003ctd\u003eCompatible with first two hardware revisions\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSystem Architecture\u003c\/td\u003e\n\u003ctd\u003eTriple Modular Redundant (RST) topology\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eIndustrial Control Backplane \u0026amp; Deterministic Networking\u003c\/h3\u003e\n\u003cp\u003eThe \u003cstrong\u003eGeneral Electric DS200TCQBG1BCB\u003c\/strong\u003e executes real-time I\/O expansion across the proprietary GE Speedtronic Mark V backplane bus. Designed for placement within the Triple Modular Redundant (TMR) RST architecture, the board conditions raw field inputs and channels processed data directly to control cores.\u003c\/p\u003e\n\u003cp\u003eInternal signal paths process analog and discrete turbine parameters while maintaining strict channel-to-channel isolation limits. The module relies on firmware flash compatibility checks with the central processor upon initialization. High-density edge connectors interface directly with the backplane to deliver low-latency feedback execution without introducing bus latency or data collisions across the control rack.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How does the DS200TCQBG1BCB function within a TMR RST architecture?\u003c\/p\u003e\n\u003cp\u003eA: The card installs into the R, S, or T core positions within the Mark V control rack, conditioning dedicated field sensor signals before outputting voting data across the proprietary backplane bus.\u003c\/p\u003e\n\u003cp\u003eQ: Is hot-swapping permitted for the DS200TCQBG1BCB board during active operations?\u003c\/p\u003e\n\u003cp\u003eA: No, live removal or insertion is strictly prohibited. Technicians must de-energize cabinet power supplies before servicing the board to prevent backplane signal corruption and component degradation from electrical surges.\u003c\/p\u003e\n\u003cp\u003eQ: What mechanisms protect internal processing logic against external field transients?\u003c\/p\u003e\n\u003cp\u003eA: Onboard isolation barriers rated to 1500 V separate field terminals from system logic, combined with integrated EMI shielding, overvoltage suppression, and short-circuit protection circuits across input lines.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cp\u003eMount the DS200TCQBG1BCB firmly into the designated Mark V rack slot, ensuring all retention screws tighten completely to establish chassis ground continuity. Verify that operating ambient temperatures inside the enclosure remain between -30 deg C and +70 deg C, with non-condensing relative humidity within 5% to 95%.\u003c\/p\u003e\n\u003cp\u003eAlign edge connectors carefully during insertion to avoid damaging backplane pin arrays. Route analog sensor wiring away from high-voltage AC cables, maintaining proper shield terminations at a single ground point. Always isolate system power prior to seating or removing the module.\u003c\/p\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":44442529759331,"sku":"DS200TCQCG1BJG","price":120.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/444._4a8ae3b7-3e97-4c02-a26c-79230afd227b.jpg?v=1785910346","url":"https:\/\/www.autocontrolglobal.com\/products\/extended-analog-i-o-board-ge-ds200tcqbg1bcb-mark-v","provider":"AutoControl Global","version":"1.0","type":"link"}