F3BA20-0N Yokogawa Base Unit Module | New & Original Stock
Manufacturer: Yokogawa
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Part Number: F3BU20-0N
Condition：New with Original Package
Product Type: Base Unit Modules
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Country of Origin: Japan
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Yokogawa F3BA20-0N FA-M3 Base Unit
The Yokogawa F3BA20-0N, also cataloged as the F3BA20-0N Base Unit Module, operates as a dedicated hardware component for providing power distribution, backplane communication, and mechanical support within FA-M3 controller platforms.
Suffix Breakdown & Model Matrix
| Code Element | Selection | Description |
|---|---|---|
| Base Model | F3BA20 | FA-M3 Base Unit Chassis Interface |
| Suffix Code | -0N | Standard specification without specialized hardware modifications |
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | F3BA20-0N |
| Brand | Yokogawa |
| Origin | Japan |
| Weight | 2.5 kg |
| Dimensions | 400 mm x 210 mm x 100 mm |
| Operating Temp | -40 to +70 deg C |
| Storage Temp | -40 to +85 deg C |
| Relative Humidity | 10% to 90% non-condensing |
| Power Supply | 24 VDC nominal input |
| Current Consumption | 1.2 A maximum internal backplane draw |
| Slots Available | 20 parallel module slots |
| Ingress Protection | IP66 dust-tight and water-resistant enclosure standard |
| Certifications | Class I, Division 2 hazardous area compliance |
Industrial Control & Backplane Bus Communication
The F3BA20-0N provides a standardized high-density slot matrix governed by rigid backplane bus communication velocity limits. The internal multi-layer printed circuit board distributes filtered power rails to each localized slot while maintaining signal trace length parity to enforce deterministic network execution across the I/O density scaling spectrum. Firmware flash compatibility across installed processing modules depends entirely on the signal propagation stability of this parallel bus architecture, which is engineered to minimize transmission degradation and inductive cross-talk under maximum signal switching loads.
Frequently Asked Questions
Q: How is the maximum 1.2 A current consumption constraint calculated across the 20 available slots?
A: The 1.2 A specification defines the maximum current capacity supported by the internal bus lines at 24 VDC. The cumulative current draw of all inserted CPU, communication, and I/O modules must not exceed this physical limit without utilizing an auxiliary power expansion module.
Q: Does the IP66 rating permit direct outdoor mounting without an external enclosure?
A: While the chassis meets IP66 ingress protection criteria against dust and low-pressure water vectors, standard engineering practice dictates installation inside a regulated, unventilated or purged control cabinet to protect the exposed terminal contacts from long-term environmental oxidation.
Q: What are the slot restriction rules for dual-redundant CPU configurations on this base unit?
A: Primary and secondary CPU modules must be installed in designated adjacent master slots to synchronize memory maps through the localized backplane bus lines without inducing propagation delay penalties.
Field Installation Guidelines
- Mechanical Mounting and Screw Torque: Secure the base unit to the rigid panel backplate using four M5 mounting screws. Apply uniform torque across all fastening points to prevent chassis torsion, which can misalign internal backplane connectors and cause intermittent contact faults.
- Shielding and Grounding Bar Infrastructure: Connect a heavy-gauge copper grounding strap from the dedicated functional earth terminal on the chassis directly to the master panel star-ground point. Maintain a low-impedance connection to shield internal bus lines from high-frequency industrial noise.
- Module Insertion Pin Alignment: Before energizing the system, verify that all 20 slot guide rails are free from debris. Insert modules perpendicular to the backplane to prevent bending the high-density connection pins, ensuring that the top and bottom mechanical lock clips engage completely.