F3LE11-1T Yokogawa Ethernet Module | New & Original Stock
Manufacturer: Yokogawa
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Part Number: F3LE11-1T
Condition:New with Original Package
Product Type: Ethernet Interface Modules
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Country of Origin: Japan
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Yokogawa F3LE11-1T FA-M3 Ethernet Interface Module
The Yokogawa F3LE11-1T, also cataloged as the F3LE11 Ethernet Interface Module, operates as a dedicated hardware component for network synchronization and data exchange within FA-M3 PLC platforms. The hardware establishes IEEE 802.3 compliant connections over copper media, supporting baseband transmission speeds of 10 Mbps and 100 Mbps via auto-negotiation routines. It handles physical-layer data framing, access control verification utilizing CSMA/CD mechanisms, and routing protocol execution across local processing nodes.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | F3LE11-1T |
| Brand | Yokogawa |
| Origin | Japan |
| Weight | 0.16 kg |
| Dimensions | 28.9 x 100 x 83.2 mm |
| Operating Temp | 0 to 55 deg C |
| Power Consumption | 1.65 W maximum (330 mA at 5 VDC nominal backplane draw) |
| Network Interface | 10BASE-T / 100BASE-TX (Full / Half Duplex) |
| Physical Connector | RJ45 modular jack |
| Maximum Segment Length | 100 m (using Cat5 or higher shielding cabling) |
| Protocols Supported | TCP/IP, UDP/IP, SMTP, POP3, ICMP, ARP |
| Status Indicators | Front-panel LEDs: LINK, ACTIVITY, 100M, ERR |
| Chassis Compatibility | FA-M3 / FA-M3V base modules |
Process Control Loops and Ethernet Field Configurations
The network module processes concurrent TCP/IP and UDP/IP sessions to exchange variable matrices with supervisory nodes without altering the calculation parameters of adjacent process control layers. It interfaces indirectly with instrumentation running the 4-20 mA HART loop protocol by routing structured data packets through intermediate gateway units. The physical architecture isolates the internal system logic from field-induced electrical transients, maintaining galvanic isolation across the backplane structure to prevent common-mode noise from corrupting high-resolution components that execute cold junction compensation (CJC) or channel-to-channel isolation within the same sub-rack assembly.
Frequently Asked Questions
Q: Does the local backplane interface support hot-swap insertion or removal while energized?
A: No. The FA-M3 base unit architecture requires complete electrical isolation prior to mounting or extracting hardware cards. Performing live physical modifications can induce unexpected backplane voltage drops or cause permanent damage to the module processor.
Q: How is flow control and collision detection managed during periods of high network congestion?
A: The module handles data access execution via built-in CSMA/CD hardware controllers. Under 100BASE-TX full-duplex operation, it supports continuous bi-directional transmission to eliminate physical collisions, relying on standard TCP windowing mechanics for end-to-end flow control.
Q: What are the layout configuration constraints regarding cascading segments?
A: The physical network limits cascading structures to a maximum of 2 or 4 segments depending on the exact hub geometry and network topologies utilized. Individual segment lengths must not exceed 100 m using Cat5 or superior copper cables to prevent signal attenuation.
Field Installation Guidelines
- Isolate all primary and secondary power supply sources feeding the FA-M3 base unit before inserting the module into its designated slot.
- Ensure the RJ45 modular jack clicks securely into place within the receptacle housing to prevent intermittent connectivity caused by mechanical vibration.
- Limit the maximum unshielded copper cable distance to 100 m per segment, routing the network lines inside dedicated low-voltage cable trays.
- Separate the communication cables from high-current AC motor leads and industrial switching networks to limit electromagnetic noise coupling.
- Confirm that all adjacent module grounding pins form a positive electrical bond with the metal DIN rail structure during final chassis assembly.