F650-B-F-G-F-2-G-1-HI-E GE F650 Digital Protection Relay
F650-B-F-G-F-2-G-1-HI-E GE F650 Digital Protection Relay
F650-B-F-G-F-2-G-1-HI-E GE F650 Digital Protection Relay
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F650-B-F-G-F-2-G-1-HI-E GE F650 Digital Protection Relay

  • Manufacturer: GE Fanuc

  • Part Number: F650BFCF2G1HI

  • Condition:New with Original Package

  • Product Type: Digital Protection Relays

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Multilin F650-B-F-G-F-2-G-1-HI-E F650 Series Feeder Protection & Bay Controller

Configured for feeder protection and distribution circuit execution in utility substations and industrial power networks, the GE Multilin F650-B-F-G-F-2-G-1-HI-E (F650 Digital Protection Relay) provides direct physical/electrical execution. This dedicated hardware unit combines comprehensive ANSI protection elements, bay control functions, dynamic local monitoring, and deterministic network automation into a panel-mounted chassis.

Suffix Breakdown & Model Matrix

The complete catalog order code specifies the exact hardware configuration, internal card assembly, and power supply option:

  • F650: Base series identifier for the Feeder Protection and Bay Controller platform.
  • B: CPU and Main Board arrangement with designated processing capacity and memory.
  • F: Front panel display interface equipped with a full graphical LCD and control keys.
  • G: Standard hardware coating and regional environmental protection spec.
  • F: Digital input/output contact arrangement and secondary CT/VT hardware selection.
  • 2: Secondary current transformer inputs configured for 1 A / 5 A system connections.
  • G: Ground current input scaling option for standard ground fault protection.
  • 1: High-density Digital Input / Digital Output card expansion profile.
  • HI: High-voltage auxiliary power supply (110–250 V AC / VDC operating range).
  • E: Ethernet communication option supporting redundant network interfaces and protocols.

Hardware Specifications

Parameter Specification
Model F650-B-F-G-F-2-G-1-HI-E
Brand GE Multilin
Origin USA
Weight 4.0 kg (8 lbs 14.4 oz)
Dimensions 23.5 cm x 26.7 cm x 18.4 cm (9.3 in x 10.5 in x 7.3 in)
Operating Temp -40 deg C to +70 deg C
Power Consumption 110–250 V AC/DC (HI option)
Protection Functions 50/51, 50N/51N, 50BF, 27/59, 81U/O, 79, Cold Load Pickup
Communication Protocols Modbus RTU/TCP, DNP3, IEC 61850
Physical Interface RS-485, Ethernet RJ45
Diagnostics Sequence of Events (SOE), Oscillography, Fault Records
Time Synchronization SNTP, IRIG-B
Mounting Flush panel mount

Deterministic Industrial Network & Backplane Integration

The GE Multilin F650-B-F-G-F-2-G-1-HI-E leverages high-speed backplane processing to execute protection algorithms alongside simultaneous communication tasks. The processing engine enforces real-time deterministic execution of overcurrent, voltage, and frequency protection elements while handling high-density I/O density scaling. Integrated Ethernet architecture ensures rapid data throughput across IEC 61850 station buses, enabling GOOSE messaging latency times that meet strict protection tripping constraints. Internal memory buses isolate fault record storage and oscillography buffer writes from protection processing routines, maintaining continuous primary protection availability without performance degradation during severe fault recording events.

Frequently Asked Questions

Q: How does the HI power supply option perform under DC battery bank fluctuations?

A: The HI power supply module operates within a continuous input range of 110–250 V AC or VDC. Internal voltage regulation circuitries handle wide voltage drops and transient surges, maintaining stable internal logic voltages and field contact wetting voltages during station battery discharge cycles.

Q: What grounding and shielding requirements apply to the secondary CT input connections?

A: Secondary CT circuits must be solidly grounded at a single point, typically at the switchgear terminal block near the relay. Route all secondary CT wiring through twisted, shielded pairs to prevent electromagnetic noise coupling into the internal low-ratio sensing transformers.

Q: Does the unit support hot-swapping of internal card modules during energized operation?

A: The chassis does not support hot-swapping of internal boards. De-energize all auxiliary power sources, open current transformer shorting blocks, and isolate potential transformer inputs before extracting or replacing internal hardware sub-assemblies.

Field Installation Guidelines

Mount the chassis into a pre-cut panel opening using the provided rear-mounting brackets. Secure the housing to the panel frame to ensure full earth grounding through the metal enclosure surface. Connect a dedicated copper grounding strap (minimum 4 mm sq) from the primary chassis grounding lug directly to the main station ground bus to divert high-frequency electrical transients and surge currents away from internal electronics.

Route low-voltage DC control signals, communication cables, and secondary CT/VT wiring through independent wiring troughs or conduit runs. Maintain a minimum clearance of 30 cm between control wiring and high-voltage power cables to eliminate inductive noise coupling. Ensure all current transformer test blocks are properly shorted prior to terminating or inspecting CT secondary wires on the rear terminal strip. Tighten all rear terminal screws to the manufacturer-specified torque limits to prevent thermal hot spots under high current loads.

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