Feeder Protection Relay Module | GE Multilin MIFIIPI55E10HI00
Feeder Protection Relay Module | GE Multilin MIFIIPI55E10HI00
Feeder Protection Relay Module | GE Multilin MIFIIPI55E10HI00
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Feeder Protection Relay Module | GE Multilin MIFIIPI55E10HI00

  • Manufacturer: GE Fanuc

  • Part Number: MIFIIPI55E10HI00

  • Condition:New with Original Package

  • Product Type: Protection Relays

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Multilin MIFIIPI55E10HI00 Feeder Relay

The GE Multilin MIFIIPI55E10HI00, also cataloged as the MIFII Feeder Relay, operates as a dedicated hardware component for high-density I/O communication and protocol integration within distributed control networks. Powered by a 10-30 VDC supply (24 VDC nominal), the unit provides 10/100/1000 Mbps Ethernet network interfacing across copper or fiber physical layers. The hardware executes high-speed data exchange for real-time process monitoring and fault-tolerant continuous control, housed inside an IP65-rated chassis measuring 150 mm x 100 mm x 50 mm.

Hardware Specifications

Parameter Specification
Model MIFIIPI55E10HI00
Brand GE Multilin
Origin USA
Weight 2 kg
Dimensions 150 mm x 100 mm x 50 mm
Operating Temp -20 deg C to +70 deg C
Power Consumption 10-30 VDC (24 VDC nominal) auxiliary power input
Protection Rating IP65 (optional conformal coating)
Network Interface 10/100/1000 Mbps Ethernet (copper and fiber physical options)
Core Functions High-density I/O communication and distributed control protocol integration
Performance High-speed real-time data exchange for continuous process loops
Mounting Options Modular compact design for rack or panel cabinet installation
Storage Temp -40 deg C to +85 deg C

Backplane Bus Communication Velocity and Deterministic Networks

The GE Multilin MIFIIPI55E10HI00 optimizes backplane bus communication velocity across EtherNet/IP and industrial automation networks. Internal protocol translation logic maintains continuous firmware flash compatibility during high-density I/O polling, preventing packet collision and transmission jitter. By managing deterministic network synchronization across local control loops, the module isolates primary processing channels from network latency spikes during high-throughput field telemetry collection.

Frequently Asked Questions

Q: How does the MIFIIPI55E10HI00 handle power supply fluctuations during continuous operation?

A: The module accepts a wide DC input range from 10 VDC to 30 VDC (24 VDC nominal). Internal power conditioning circuits isolate logic components from transient voltage drops and electrical line noise.

Q: What environmental protection features allow operation in demanding locations?

A: The module features an IP65-rated housing designed to operate across a temperature range of -20 deg C to +70 deg C, with optional conformal coating to prevent board corrosion in humid or airborne contaminant environments.

Q: What network physical interfaces and transmission speeds are available?

A: The module provides high-density Ethernet connectivity supporting 10/100/1000 Mbps auto-negotiation, with copper RJ-45 or fiber-optic port options based on chassis hardware configuration.

Field Installation Guidelines

Field engineers must follow these installation standards during cabinet and panel integration:

  • Mount the 150 mm x 100 mm x 50 mm module securely into standard 19-inch racks or flat panel assemblies using proper mounting hardware.
  • Terminate the 10-30 VDC power supply connections onto dedicated power terminals, verifying supply voltage level and wire polarity prior to applying main power.
  • Establish a direct ground connection between the metallic chassis enclosure and the main panel ground bus using a short, low-impedance copper conductor.
  • Route copper Ethernet cables and fiber-optic patch leads in separate low-voltage wiring trays, maintaining specified cable bend radii to prevent signal loss or mechanical degradation.
  • Verify IP65 sealing gaskets on enclosure access covers and gland plates before commissioning the module in exposed environments.
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