GE DS200DTBAG1A Mark V Speedtronic Digital Terminal Boards
GE DS200DTBAG1A Mark V Speedtronic Digital Terminal Boards
GE DS200DTBAG1A Mark V Speedtronic Digital Terminal Boards
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GE DS200DTBAG1A Mark V Speedtronic Digital Terminal Boards

  • Manufacturer: GE Fanuc

  • Part Number: DS200DTBAG1A

  • Condition:New with Original Package

  • Product Type: Digital Contact Terminal Boards

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE DS200DTBAG1A Mark V Speedtronic Digital I/O Board

The GE DS200DTBAG1A, also cataloged as the DS200DTBA Digital Contact Terminal Board, operates as a dedicated hardware component for digital input/output signal aggregation and power isolation within Mark V Speedtronic networks. The module interfaces field switches, interlocks, and relay channels directly with central processing cores through high-density terminal terminations.

Hardware Specifications

Parameter Specification
Model DS200DTBAG1A
Brand General Electric (GE)
Origin USA
Weight Standard Industrial Weight
Dimensions Standard Rack Form Factor
Operating Temp -40 deg C to +85 deg C
Power Consumption Passive Terminal Interface / 2 A Contact Rating
Base Model DS200DTBA
Series Mark V Speedtronic
Product Type Digital Contact Terminal Boards
Terminal Capacity 2 x 95-point pluggable blocks (190 total)
Input Signal Types Dry contact, 24 VDC active, 48 VDC active (jumper-selectable)
Output Contacts Relay contacts: 2 A at 240 VAC (Form-A/C selectable)
Response Time <= 0.5 ms (on), <= 0.25 ms (off)
Bus Interconnects 3 x 50-pin ribbon cables (JFF, JFG, JFH), 2 x 2-pin bayonet connectors
Configuration Jumpers 5 functional jumpers (JP1-JP5)
Isolation Group isolation
Compliance Standard API 670 SIL2

Backplane Bus Architecture & Deterministic Fieldbus Routing

The terminal board transmits digital input transitions across dedicated 50-pin ribbon harnesses (JFF, JFG, and JFH) directly to the Mark V control backplane, ensuring zero-latency signal delivery to Triple Modular Redundant (TMR) processing cores. Integrated onboard jumpers (JP1 through JP5) select input field voltage levels without requiring software reconfiguration, while firmware flash compatibility across host controllers maintains continuous status polling over high-velocity internal buses. High-density output relay contacts execute switching states down to sub-millisecond response times, maintaining deterministic sequence-of-events recording across the entire control system.

Frequently Asked Questions

Q: How does the DS200DTBAG1A handle signal routing in Triple Modular Redundant (TMR) configurations?

A: The board distributes incoming dry and active contact inputs simultaneously across three independent 50-pin ribbon cables (JFF, JFG, JFH), enabling parallel signal voting across separate controller cores.

Q: Can maintenance personnel service terminal connections while the Mark V panel remains powered?

A: Yes, the board features pluggable, hot-swappable terminal blocks that allow wiring maintenance without removing main power from the host cabinet.

Q: What contact rating is available on the integrated output relays for direct actuator driving?

A: The board integrates Form-A/C selectable relay contacts rated for up to 2 A at 240 VAC, allowing direct actuation of fuel valves and field breakers without interposing relays.

Field Installation Guidelines

  1. Disconnect all external field wiring power sources and verify zero voltage across input terminals before initiating hardware placement.
  2. Secure the main circuit board frame into the Mark V rack enclosure using standard retaining hardware to maintain chassis structural stability.
  3. Position jumpers JP1 through JP5 according to engineering drawings to set 24 VDC, 48 VDC, or dry contact field sensing modes prior to wiring.
  4. Attach 50-pin ribbon cables JFF, JFG, and JFH securely to their respective backplane connectors, ensuring locking latches engage fully to resist vibration.
  5. Terminate field switch leads onto the pluggable 95-point terminal blocks, verify correct contact polarity, and snap the block assemblies into position on the board.
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