GE Emerson IC694ALG223A PACSystems RX3i 16-CH Current Input Module
Manufacturer: GE Fanuc
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Part Number: IC694ALG223A
Condition：New with Original Package
Product Type: Analog Input Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Emerson IC694ALG223A PACSystems RX3i Analog Current Input Module
The GE Emerson IC694ALG223A, also cataloged as the IC694ALG223 16-Channel Analog Current Input Module, operates as a dedicated hardware component for converting 0-20 mA and 4-20 mA transmitter signals into 12-bit digital values within PACSystems RX3i control networks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694ALG223A |
| Brand | GE Emerson |
| Origin | USA |
| Weight | 0.27 kg (270 g) |
| Dimensions | Single-slot PACSystems RX3i rack module |
| Operating Temp | 0 deg C to +60 deg C |
| Storage Temp | -40 deg C to +85 deg C |
| Power Consumption | 120 mA at 5 VDC, 65 mA at 24 VDC (external field supply) |
| Channel Count | 16 single-ended current input channels |
| Input Ranges | 0-20 mA, 4-20 mA, enhanced 4-20 mA with open-wire detection |
| Resolution | 12-bit |
| Conversion Speed | 13 ms per channel |
| Measurement Accuracy | +/-0.1% of full scale |
| Repeatability | +/-0.05% of span |
| Isolation | Channel-to-PLC backplane isolation |
| Certifications | UL, UL HAZLOC, CE, ATEX C1D2, Zone 2, Marine (ABS, BV, DNV, GL, KRS, LR) |
| Humidity | 5-95% non-condensing |
RX3i Backplane Integration and I/O Density Scaling
The module scales channel density by accommodating 16 process current loops within a single PACSystems RX3i backplane slot. Onboard analog-to-digital converters process current inputs across user-selected ranges (0-20 mA, 4-20 mA, or enhanced 4-20 mA). In enhanced mode, internal diagnostic circuits continuously monitor loop continuity to trigger open-wire fault conditions without halting background processing. Backplane communication bus velocity allows the module to pass digitized channel data and configurable high/low threshold alarm states to the CPU within designated scan periods. Hot-swap backplane design permits module extraction and re-insertion under system power, preserving operational continuity across remaining rack slots.
Frequently Asked Questions
Q: How does open-wire detection operate on the IC694ALG223A?
A: When configured in enhanced 4-20 mA mode, the onboard diagnostic logic detects current levels dropping below the low-end threshold and immediately reports an open-wire fault bit to the CPU status register.
Q: What are the external power requirements for field-side analog current loops?
A: The input circuitry requires an isolated external 24 VDC supply drawing 65 mA to power loop instrumentation alongside the 120 mA drawn from the 5 VDC backplane bus.
Q: Can the IC694ALG223A be hot-swapped during active system execution?
A: Yes. The PACSystems RX3i backplane architecture supports hot-swapping, enabling module replacement without powering down the rack or interrupting neighboring I/O cards.
Field Installation Guidelines
Power off external field supplies or isolate current loops prior to field terminal wiring. Insert the module card edge firmly into the designated RX3i rack slot until the upper and lower backplane retention latches engage completely.
Connect 4-20 mA field transmitter leads to the designated terminal block points. Route low-voltage analog signal cables through grounded, dedicated raceways, maintaining a minimum separation distance of 200 mm from high-voltage AC conductors and motor power cables. Connect cable shield drain wires to a single low-impedance earth ground point at the enclosure entry point to eliminate ground potential loops. Verify proper airflow clearance above and below the module rack assembly to sustain operating temperatures within the 0 deg C to +60 deg C rating.