GE Fanuc IC200CHS003M VersaMax Connector Style I/O Carrier
Manufacturer: GE Fanuc
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Part Number: IC200CHS003M
Condition：New with Original Package
Product Type: I/O Module Carriers
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE IC200CHS003M VersaMax Connector Style I/O Carrier
Configured for physical module mounting and signal distribution in GE Fanuc VersaMax control networks, the GE IC200CHS003M (IC200CHS003 Connector Style I/O Carrier) provides direct physical/electrical execution.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC200CHS003M (Base Model: IC200CHS003) |
| Brand | GE Fanuc / Emerson |
| Origin | United States |
| Weight | 0.28 kg (0.63 lbs) |
| Dimensions | 120 x 90 x 40 mm |
| Operating Temp | 0 to 60 deg C |
| Storage Temp | -40 to 85 deg C |
| Power Consumption | Powered via 5 VDC backplane |
| Termination Type | Integrated 36-pin connector / Connector style |
| I/O Point Capacity | Up to 32 input/output points |
| Rated Current | 2 A per point (8 A maximum per power/ground) |
| Isolation Voltage | 1500 V RMS field side to logic side |
| Contact Resistance | Less than 10 milliohms |
| Housing Material | Acrylonitrile Butadiene Styrene (ABS) plastic |
| Degree of Protection | IP20 |
| Mounting Orientation | Vertical mount / 35 mm DIN rail or panel mount |
| Operating Humidity | 5 to 95% RH, non-condensing |
Backplane Bus Communication Velocity & I/O Density Scaling
The GE IC200CHS003M serves as a passive structural and electrical conduit that directly interfaces active VersaMax I/O modules with the system backplane bus. By routing field signals directly through its integrated 36-pin connector interface, the unit maintains backplane bus communication velocity without introducing propagation delay or impedance mismatches across high-density I/O point scaling configurations. The internal terminal bus traces maintain under 10 milliohms of contact resistance, preserving logic signal integrity and ensuring full firmware flash compatibility when swapping various discrete or analog field modules into the carrier slot.
Frequently Asked Questions
Q: How does the 36-pin connector design impact field wiring routines during module replacement?
A: The connector-style interface decouples field wiring from the active electronic module. Technicians can seat or unseat the VersaMax I/O module from the IC200CHS003M carrier without disturbing the 36-pin pre-wired harness, avoiding potential miswiring errors during maintenance.
Q: What are the current carrying limits for power and ground distribution across the carrier?
A: The carrier structure supports up to 2 A per individual point across up to 32 I/O channels. However, the total current routed through any single common power or ground connection must not exceed 8 A to prevent thermal degradation of the internal traces.
Q: What protection level does the carrier housing provide against voltage surges on the field side?
A: The unit features an IP20-rated ABS plastic enclosure designed to withstand transient voltage spikes up to 300 VAC maximum, backed by 1500 V RMS galvanic isolation between field-side connections and logic backplane traces.
Field Installation Guidelines
- Mount the carrier vertically on a standard 35 mm DIN rail or panel surface, ensuring the ground spring makes firm, bare-metal contact with the grounded DIN rail.
- Inspect the 36-pin connector pins for alignment before mating the field harness to avoid bending or galling the electrical contacts.
- Ensure total field load current per channel does not exceed 2 A, and keep total power bus connection current under 8 A per common return block.
- Route 36-pin connector cables through cable management channels separated from high-voltage AC lines to minimize electrical noise coupling into sensitive analog or discrete signals.
- Maintain a minimum of 20 mm clearance around the carrier chassis to allow proper thermal dissipation and unhindered latch operation during module insertion.