GE Fanuc IC200CHS005 VersaMax Spring-Style I/O Carrier
Manufacturer: GE Fanuc
-
Part Number: IC200CHS005
Condition：New with Original Package
Product Type: I/O Terminal Bases
-
Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC200CHS005 VersaMax Spring-Style I/O Carrier
The GE Fanuc IC200CHS005 serves as the primary IC200CHS005 Spring-Style I/O Carrier utilized to execute signal routing and backplane bus power distribution across VersaMax I/O platforms. The module mounts directly onto standard 35 mm DIN rails, accommodating a single VersaMax I/O module while establishing power, logic, and physical terminal connections. Featuring 36 spring-clamp terminals, it provides termination for up to 32 I/O points alongside 4 shared power distribution buses rated up to 264 V AC and 8.0 A total current capacity.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC200CHS005 |
| Brand | GE Fanuc / Emerson |
| Origin | USA |
| Weight | 0.88 lbs (0.40 kg) |
| Dimensions | 132 mm x 110 mm x 50 mm |
| Operating Temp | 0 deg C to +60 deg C |
| Storage Temp | -40 deg C to +85 deg C |
| Power Consumption | Passive pass-through (8.0 A maximum power bus capacity) |
| Termination Type | 36 Spring-clamp style terminals |
| Voltage Rating | 264 V AC maximum |
| Current Capacity | 8.0 A total power/ground bus, 2.0 A per point |
| Shared Power Connections | 4 bus connections |
| I/O Capacity | 32 I/O points per module carrier |
| Mounting Method | Standard 35 mm DIN rail or base panel mount |
| Orientation | Horizontal base orientation |
| Standards & Certifications | UL, CE, CSA |
I/O Density Scaling & Backplane Bus Integrity
The IC200CHS005 carrier establishes structured I/O density scaling within compact VersaMax drop configurations. Internal backplane bus connectors pass high-speed logic communications and module operating voltages directly between adjacent carriers without external inter-rack wiring. The spring-clamp connection block maintains constant contact pressure against solid or stranded conductors (0.14 mm2 to 1.5 mm2), resisting mechanical vibration while eliminating terminal screw retightening maintenance. Integrated power distribution buses distribute up to 8.0 A across shared terminal groups to isolate field supply lines from logic bus signals.
Frequently Asked Questions
Q: What wire gauge range does the IC200CHS005 spring-clamp terminal block accept?
A: The spring-clamp terminals accept solid or stranded copper wire sizes ranging from 0.14 mm2 to 1.5 mm2 (26 AWG to 16 AWG) stripped to a standard length of 8 mm to 9 mm.
Q: Can I remove or insert an I/O module from the IC200CHS005 carrier while backplane power is applied?
A: No, module removal or insertion requires removing power from the VersaMax rack backplane to prevent data bus interruption or transient arc discharge across internal backplane pins.
Q: How are field power and common signals distributed across the carrier terminals?
A: The carrier contains 4 shared internal power connections rated for 8.0 A total current, allowing common power leads to jumper internally across channels without external distribution blocks.
Field Installation Guidelines
First, align the IC200CHS005 carrier onto the 35 mm DIN rail in a horizontal orientation, pressing firmly until the rear locking latch fully engages the rail lip. Next, snap adjacent VersaMax carriers together along the horizontal plane to mate the internal backplane bus connectors securely before mounting the upper I/O module.
When wiring field devices, strip individual conductors to 8 mm. Insert a flat-head screwdriver into the spring release slot, push down to open the internal clamp, insert the stripped conductor wire, and remove the screwdriver to establish a gas-tight mechanical connection. Finally, route all AC power wiring away from sensitive DC input lines and verify that the earth ground connection on the DIN rail provides a low-impedance path to cabinet ground.
SEO Suite