GE Fanuc IC670CHS002 IC670CHS002E Field Control Terminal Base
Manufacturer: GE Fanuc
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Part Number: IC670CHS002
Condition：New with Original Package
Product Type: I/O Terminal Bases
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC670CHS002 Field Control Terminal Block
The GE Fanuc IC670CHS002, also cataloged as the IC670CHS002E I/O Terminal Base, operates as a dedicated hardware component for physical field wiring termination and module interconnections within GE Field Control systems. It provides direct electrical connectivity for up to two Field Control I/O modules, routing field signals through internal backplane buses to the primary Bus Interface Unit.
Suffix Breakdown & Model Matrix
| Part Number / Identifier | Hardware Revision & Status Description |
|---|---|
| IC670CHS002 | Base Field Control 2-Tier Box Terminal Base Model |
| IC670CHS002A | Legacy Hardware Revision Variant |
| IC670CHS002D | Intermediate Hardware Revision Variant |
| IC670CHS002E | Updated Production Revision Unit |
| IC670CHS002F | Final Production Revision Designation |
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC670CHS002 (Revision Variant: IC670CHS002E) |
| Brand | GE Fanuc |
| Origin | USA |
| Weight | 0.51 kg (1.13 lbs) / Alternate Base: 0.10 kg (0.04 lbs - 0.22 lbs) |
| Dimensions | 25 mm x 108 mm x 127 mm (1.0 in x 4.25 in x 5.0 in) |
| Operating Temp | 0 deg C to 55 deg C (Storage: -20 deg C to +85 deg C) |
| Power Consumption | Passive Base (10 A max current capacity per terminal) |
| Rated Voltage | 24 VDC Nominal Field Bus Voltage |
| Module Capacity | Accommodates up to 2 I/O modules (Suffix J or later) |
| Terminal Type | 37-position 2-tier box screw terminals |
| Wire Size | One AWG #14 or two AWG #18 to AWG #22 |
| Screw Terminal Torque | 4.5 in-lbs (0.51 Nm) |
| Mounting Style | 35 mm DIN rail mountable or direct panel mount |
Backplane Bus Communication Velocity & I/O Density Scaling
The IC670CHS002 maintains backplane bus communication velocity across adjacent terminal bases through multi-pin internal connectors, passing logic signals without latency. Its dual-tier box terminal arrangement expands I/O density scaling inside control enclosures by accommodating 37 wiring termination points across a compact mounting footprint. Integrated firmware flash compatibility across installed processing cards relies on the base's mechanical alignment tracks to establish solid pin engagement and uncorrupted bus routing.
Frequently Asked Questions
Q: Does replacing an installed I/O module on the IC670CHS002 require disconnecting field wiring?
A: No. The I/O modules seat directly onto the top of the terminal base structure, allowing technicians to replace faulty modules without disturbing external field wiring terminated at the screw blocks.
Q: What is the maximum current rating permitted across individual screw terminals?
A: Each screw terminal supports a continuous maximum current load of 10 A.
Q: Can the IC670CHS002 base accommodate two wires per terminal point?
A: Yes. Each terminal position accepts either a single AWG #14 wire or two individual conductors ranging from AWG #18 to AWG #22.
Field Installation Guidelines
- De-energize all primary subrack supply power and external field wiring circuits prior to mounting or wiring the base unit.
- Snap the base assembly securely onto a standard 35 mm DIN rail or fasten it directly to the enclosure backpanel using mounting hardware.
- Strip field conductors to the specified strip length, insert wires into the 2-tier box terminals, and torque all screws to 4.5 in-lbs (0.51 Nm).
- Verify mechanical guide alignment before pressing I/O modules onto the base connector interface to avoid bending backplane contacts.
- Maintain adequate physical separation between high-voltage AC field wiring lines and low-voltage DC communication logic signals.