{"product_id":"ge-fanuc-ic693cpu360dh-series-90-30-datasheet-technical-manual","title":"GE Fanuc IC693CPU360DH Series 90-30 Datasheet \u0026 Technical Manual","description":"\u003ch2\u003eGE Fanuc IC693CPU360DH Series 90-30 PLC\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC693CPU360DH\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eGE Fanuc IC693CPU360\u003c\/strong\u003e CPU Module, serves as the primary \u003cstrong\u003eGE Fanuc IC693CPU360\u003c\/strong\u003e CPU Module utilized to execute high-performance logic calculations across Series 90-30 PLC platforms.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC693CPU360DH\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.45 kg module baseline \/ 0.9 kg complete assembly\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e160 mm x 100 mm x 45 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to +60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eBackplane logic bus current draw dependent\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProcessor Type\u003c\/td\u003e\n\u003ctd\u003eIntel 386EX, 32-bit architecture\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProcessor Speed\u003c\/td\u003e\n\u003ctd\u003e25 MHz\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eUser Program Memory\u003c\/td\u003e\n\u003ctd\u003e240 KB (RAM)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRegister Memory\u003c\/td\u003e\n\u003ctd\u003eUp to 9,999 words (32K words configurable data memory)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBoolean Execution Speed\u003c\/td\u003e\n\u003ctd\u003e0.22 ms to 0.6 ms per 1K logic instructions\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDiscrete I\/O Capacity\u003c\/td\u003e\n\u003ctd\u003e2048 DI \/ 2048 DO (Up to 4,096 points total)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAnalog Capacity\u003c\/td\u003e\n\u003ctd\u003e1024 AI \/ 256 AO (Up to 1,024 channels total)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCommunication Ports\u003c\/td\u003e\n\u003ctd\u003e1 x RS-232 serial port, 1 x RS-485 serial port (SNP \/ SNPX)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eEnclosure Baseplate Compatibility\u003c\/td\u003e\n\u003ctd\u003e5-slot or larger 90-30 rack\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProgram Retention\u003c\/td\u003e\n\u003ctd\u003eBattery-backed RAM or optional EEPROM \/ flash memory\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStorage Temperature\u003c\/td\u003e\n\u003ctd\u003e-20 to +70 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRelative Humidity\u003c\/td\u003e\n\u003ctd\u003e5% to 95% non-condensing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCertifications\u003c\/td\u003e\n\u003ctd\u003eUL, CE, CSA approved\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eIndustrial Control and Drives Bus Management\u003c\/h3\u003e\n\u003cp\u003eThe 32-bit controller architectural core implements a 25 MHz processing loop to regulate backplane bus communication velocity Licences across the rack assembly. This processing speed maintains deterministic I\/O density scaling transitions across up to 4,096 discrete points while executing Boolean sweeps between 0.22 ms and 0.6 ms per 1K of logic instructions. The physical link subsystem routes data payloads concurrently across internal serial SNP\/SNPX pathways and peripheral networking structures, utilizing firmware flash compatibility constraints to isolate host processing registers from transient field communication faults.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: What are the backplane current constraints when deploying the IC693CPU360DH module in older Series 90-30 racks?\u003c\/p\u003e\n\u003cp\u003eA: The 32-bit CPU module draws its native logic power directly from the 5 VDC rack bus rail. Engineers must confirm that the power supply module mounted on the baseplate has adequate residual current margin to accommodate the processor along with any adjacent high-density I\/O modules.\u003c\/p\u003e\n\u003cp\u003eQ: How is logic memory retention managed during a total input power disruption?\u003c\/p\u003e\n\u003cp\u003eA: Volatile user memory retention relies on a standard rack-mounted lithium battery assembly backup. Alternatively, configurations can be compiled and burned into non-volatile EEPROM or flash memory modules to allow direct system boot-up execution following long-term shutdown periods.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eChassis Slot Placement:\u003c\/strong\u003e Insert the CPU module into the dedicated left-hand slot position of a 5-slot or larger Series 90-30 baseplate assembly. Ensure the rear multi-pin pin-and-socket connectors seat squarely into the backplane before engaging the plastic mechanical clips.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSerial Cable Shield Grounding:\u003c\/strong\u003e Route all RS-485 and RS-232 communication lines inside grounded metal wire ways located away from high-voltage motor starters, switching relays, or variable frequency drive cables to maximize cross-talk suppression.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThermal Boundary Clearance Constraints:\u003c\/strong\u003e Maintain proper ventilation clearances above and below the rack chassis. Ensure that internal cabinet air temperatures surrounding the module remain between 0 and +60 deg C to protect the 25 MHz 386EX micro-components from thermal stress.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":44264973631587,"sku":"IC693CPU360DH","price":420.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/58_33891e68-3f06-4999-9832-02a94f1b3347.jpg?v=1781687884","url":"https:\/\/www.autocontrolglobal.com\/products\/ge-fanuc-ic693cpu360dh-series-90-30-datasheet-technical-manual","provider":"AutoControl Global","version":"1.0","type":"link"}