GE Fanuc IC694ALG233 PACSystems RX3i Analog Current Input Board
GE Fanuc IC694ALG233 PACSystems RX3i Analog Current Input Board
GE Fanuc IC694ALG233 PACSystems RX3i Analog Current Input Board
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GE Fanuc IC694ALG233 PACSystems RX3i Analog Current Input Board

  • Manufacturer: GE Fanuc

  • Part Number: IC694ALG233

  • Condition:New with Original Package

  • Product Type: Analog Input Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Fanuc IC694ALG233 PACSystems RX3i Analog Current Input Board

The GE Fanuc IC694ALG233, also cataloged as the IC694ALG233 Analog Current Input Module, operates as a dedicated hardware component for 16-channel analog signal acquisition within PACSystems RX3i control networks. The unit converts single-ended field current inputs into 16-bit digital values, updating all channels in 5 to 6 ms. Furthermore, the internal conversion circuitry supports independent per-channel range assignments across 0-20 mA, 4-20 mA, and enhanced 4-20 mA operating modes while maintaining channel-to-PLC isolation across the rack backplane.

Hardware Specifications

Parameter Specification
Model IC694ALG233
Brand GE Fanuc / Emerson
Origin USA
Weight 0.5 kg
Dimensions Single-slot RX3i rack module form factor
Operating Temp 0 to +60 deg C
Power Consumption 120 mA @ 5 VDC (backplane), 65 mA @ 24 VDC
Module Type Analog Current Input Module
Input Channels 16 single-ended channels
Input Current Ranges 0-20 mA, 4-20 mA, Enhanced 4-20 mA
Resolution 16-bit
Conversion Time 6 ms per channel (5 to 6 ms total update)
Accuracy +/-0.1% full scale (typical)
Repeatability +/-0.05% of span
Isolation Channel-to-PLC backplane isolation
Hazardous Area Rating Zone 2, Class I Division 2 (ATEX / UL HAZLOC)

I/O Density Scaling & Firmware Flash Compatibility

The GE Fanuc IC694ALG233 provides high I/O density scaling by packing 16 single-ended current channels into a single backplane slot, thereby minimizing rack footprint in large PACSystems RX3i architectures. Consequently, the backplane interface executes high-velocity bus communications to deliver updated 16-bit integer values directly to the CPU memory table every 6 ms. Onboard firmware flash compatibility ensures seamless synchronization across RX3i CPU firmware revisions, enabling active hot-swapping without requiring backplane power cycling or system reboot routines.

Frequently Asked Questions

Q: How does the IC694ALG233 execute open-wire detection on field current loops?

A: When configured for 4-20 mA or Enhanced 4-20 mA ranges, the module continuously monitors loop current. If the signal drops below the operating threshold, the module triggers an open-wire diagnostic alarm flag bit in the PLC status table.

Q: Can individual channels on the IC694ALG233 be configured for different current ranges simultaneously?

A: Yes, each of the 16 input channels allows independent software configuration for 0-20 mA, 4-20 mA, or Enhanced 4-20 mA ranges without needing physical hardware jumpers.

Q: What are the backplane power supply requirements for installing this module in an RX3i rack?

A: The module draws 120 mA from the internal 5 VDC backplane bus and requires an auxiliary 65 mA current draw from a 24 VDC user power supply.

Field Installation Guidelines

Align the module with the designated RX3i rack slot and pivot the top hooks into the backplane notch before pushing the lower connector firmly until the module latches into position. Although the board supports hot-swapping under powered backplane conditions, field technicians must verify that external 24 VDC loop power is isolated prior to disconnecting or wiring the terminal block.

Route all 4-20 mA field signals using shielded twisted-pair cabling to minimize electromagnetic interference. Ground the cable shields at a single point on the enclosure earth ground bus bar rather than terminating them directly to the module terminals. Ensure all terminal screws are torqued properly to maintain reliable low-resistance contact, and maintain a minimum 50 mm clearance above and below the rack to allow natural convective airflow within the specified 0 to +60 deg C thermal limit.

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