GE Fanuc IC694MDL660 PACSystems RX3i Digital Input Modules
Manufacturer: GE Fanuc
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Part Number: IC694MDL660-BC
Condition：New with Original Package
Product Type: Digital Input Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC694MDL660 PACSystems RX3i Input Module
Configured for discrete signal ingestion across PACSystems RX3i platforms, the GE Fanuc IC694MDL660-BC (IC694MDL660 discrete input module) provides direct physical/electrical execution for 32 input points. It interfaces 24 VDC field sensors, switches, and pushbuttons utilizing positive or negative logic configurations across four isolated groups.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL660-BC |
| Brand | GE Fanuc / Emerson |
| Origin | United States |
| Weight | 0.60 kg (1.31 lbs) |
| Dimensions | 38.1 x 140.0 x 140.0 mm |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 300 mA maximum at 5 VDC backplane |
| Input Points | 32 (4 isolated groups of 8 channels) |
| Rated Voltage | 24 VDC (0 to 30 VDC operating range) |
| On-State Current | 3.2 mA minimum (7.0 mA typical at 24 VDC) |
| Off-State Current | 1.1 mA maximum |
| Filter Times | 0.5, 1.0, 2.0, 5.0, 10.0, 50.0, 100.0 ms (selectable) |
| Isolation | 1500 VAC field-to-backplane, 250 VAC group-to-group |
| Required Connector | IC694TBB032 or IC694TBS032 terminal block |
Deterministic I/O Density & Backplane Bus Protocols
The IC694MDL660 interfaces directly with the high-speed PACSystems RX3i backplane bus to ensure low-latency data access across all 32 channels. Channel-to-channel group isolation prevents noise propagation between field loops, while internal firmware compatibility ensures deterministic input processing without overloading CPU scan cycles. High I/O density scaling conserves rack space, maintaining fast hardware interrupt delivery to RX3i CPUs running firmware version 2.90 or higher.
Frequently Asked Questions
Q: Does the IC694MDL660 support hot-swapping while the RX3i rack is running?
A: Yes, the PACSystems RX3i backplane supports hot-insertion and hot-removal of this module. System operators can perform module replacements without de-energizing rack power or stopping CPU program execution.
Q: Which CPU versions are required to run this input card?
A: The IC694MDL660 requires an RX3i CPU running firmware version 2.90 or greater. Attempting to use this module with earlier CPU firmware releases will result in module recognition failures on the backplane bus.
Q: How do selectable filter times affect signal processing?
A: Input filter settings (adjustable from 0.5 ms to 100 ms) suppress electrical contact bounce and high-frequency noise on field lines. Response times match the selected filter parameter to guarantee stable state transitions before reporting data to the backplane.
Field Installation Guidelines
Mount the IC694MDL660 directly into any available RX3i universal or expansion baseplate slot. Secure field cables via the required IC694TBB032 box-style or IC694TBS032 spring-clamp 36-pin terminal block. Verify that field wiring for each 8-channel group matches the intended positive (sinking) or negative (sourcing) common configuration. Route 24 VDC signal cables separately from high-voltage AC lines by at least 300 mm to avoid signal coupling. Maintain a minimum single-point earth ground on shielded lines near the cabinet entry point, and ensure panel thermal convection remains unblocked to keep ambient temperatures between 0 and 60 deg C.