GE Fanuc IC694MDL930 PACSystems RX3i Relay Output Module 3300
Manufacturer: GE Fanuc
-
Part Number: IC694MDL930
Condition:New with Original Package
Product Type: Relay Output Modules
-
Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Emerson IC694MDL930 PACSystems RX3i Relay Output Module
Configured for high-density load switching in PACSystems RX3i systems, the GE Emerson IC694MDL930 (IC694MDL930 Relay Output Module) provides direct physical/electrical execution. This module directly actuates external field devices by isolating and routing discrete physical signals through independent Form A dry contacts. The design operates without polarity dependence across mixed AC/DC circuits, suppressing unwanted signal interaction while managing continuous current delivery to inductive and resistive loads.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL930 |
| Brand | GE Emerson / GE Fanuc |
| Origin | United States |
| Weight | 0.40 kg (0.88 lbs) |
| Dimensions | Standard RX3i single-slot module profile |
| Operating Temp | 0 deg C to 60 deg C |
| Power Consumption | 6 mA @ 5 VDC backplane, 70 mA @ 24 VDC backplane relay power |
| Output Type | 8 Form A (Normally Open, N.O.) dry relay contacts |
| Isolation Rating | 250 VAC continuous; 1500 VAC for 1 min (point-to-point, field-to-backplane) |
| Operating Voltage Range | 5 to 30 VDC, 5 to 250 VAC (50/60 Hz) |
| Output Current Rating | 4.0 A resistive max per point; 2.0 A pilot duty max per point |
| Minimum Load Current | 10 mA per point |
| Maximum Inrush Current | 5.0 A peak |
| Response Time | 15.0 ms maximum (On/Off, including contact bounce) |
| Relay Contact Life | 150,000 to 1,000,000 operations (load dependent) |
| Field Wiring Connection | Integrated 20-screw removable terminal block |
Backplane Bus Communication Velocity and Density Scaling
The module communicates via the local PACSystems RX3i backplane bus, utilizing deterministic synchronization protocols to transfer output state data from the CPU to the physical relay coils. Internal logic circuits map each individual channel directly to corresponding output images in the controller memory without introduces latency during logic scans. The physical construction leverages channel-to-channel galvanically isolated paths to prevent noise coupling across adjacent circuits. Standard backplane bus clock timing drives internal optical isolation stages, separating low-voltage logic processing from high-voltage field switching loops.
Frequently Asked Questions
Q: Does the IC694MDL930 module support live hot-swapping during system operation?
A: No, the module does not support hot-swapping. Inserting or removing the card while backplane or field power is applied risks physical damage to edge connectors and may trigger unexpected output state transitions across active field circuits. Always de-energize backplane and field supply power before module insertion or removal.
Q: What are the backplane current draw requirements when all relay outputs are energized?
A: The hardware draws a maximum of 6 mA from the internal 5 VDC backplane bus for logic operations, alongside 70 mA from the 24 VDC backplane relay power bus when all 8 channels remain simultaneously energized in the ON state.
Q: Is internal overcurrent fusing provided on individual output channels?
A: No, the module contains no internal current-limiting fuses or electronic short-circuit protection on its relay channels. External fast-acting fuses or circuit breakers sized according to individual load characteristics must be wired in series with each channel circuit to prevent physical contact damage under fault conditions.
Field Installation Guidelines
Mount the unit securely into any available local RX3i or Series 90-30 I/O rack slot. Ensure all external power supplies are de-energized prior to seating the module edge connector into the backplane. Secure field connections to the 20-screw terminal block using AWG #22 to #16 copper conductors for dual-wire setups or AWG #14 for single-wire runs rated for at least 90 deg C.
Route field power conductors in dedicated wire raceways separated from sensitive low-voltage analog and communications signal cabling by a minimum distance of 300 mm to mitigate electromagnetic interference. Connect field signal shielding to the main frame ground bus bar at a single point to break ground loops. When switching inductive loads such as motor starters or solenoids, install external snubber circuits (RC networks for AC, flyback diodes for DC) directly across field loads to suppress voltage transients and protect contact longevity.