GE Fanuc IC697BEM742 Series 90-70 FIP Bus Controller Modules
Manufacturer: GE Fanuc
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Part Number: IC697BEM742
Condition：New with Original Package
Product Type: FIP Bus Controller Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC697BEM742 Series 90-70 FIP Bus Controller Modules
The GE Fanuc IC697BEM742, also cataloged as the IC697BEM742 FIP Bus Controller Module, operates as a dedicated hardware component for distributed field device communication within Series 90-70 networks. Installed inside a single-slot IC697 VME rack frame, the board routes real-time telemetry and control commands between the central PLC processor and external field nodes over dual FIP network channels.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC697BEM742 |
| Brand | GE Fanuc (GE) |
| Origin | USA |
| Weight | 0.54 kg |
| Dimensions | 172 mm x 33 mm x 142 mm |
| Operating Temp | Standard Industrial Range |
| Power Consumption | 6.5 W (1.3 A at 5 VDC) |
| Base Model | IC697BEM742 |
| Series | Series 90-70 |
| Product Type | FIP Bus Controller Modules |
| Communication Protocol | Factory Instrumentation Protocol (FIP) |
| Form Factor | Single-slot IC697 VME rack module |
| Operating Voltage | 5 VDC backplane supply |
| Architecture | Dual-channel redundant interface |
Deterministic Ethernet Networks & Backplane Synchronization
The module interfaces directly with the IC697 VME backplane bus, maintaining optimal backplane bus communication velocity while drawing 1.3 A at 5 VDC from the system power supply rail. By leveraging hardware-level determinism over dual Factory Instrumentation Protocol (FIP) communication channels, the controller executes periodic data exchanges with high field I/O density scaling. Integrated firmware flash compatibility ensures synchronized cyclic scanning across redundant CPU racks without inducing control loop jitter or transmission latency during heavy traffic cycles.
Frequently Asked Questions
Q: How does the IC697BEM742 module draw power within the IC697 VME rack enclosure?
A: The module draws power directly from the 5 VDC system backplane bus, consuming a rated current of 1.3 A during continuous operation.
Q: Can the IC697BEM742 module be deployed in high-availability redundant architectures?
A: Yes, the board supports redundant dual-channel FIP network topologies to maintain continuous communication links if a primary network path fails.
Q: What physical rack space does the IC697BEM742 occupy inside the Series 90-70 chassis?
A: The module is engineered as a standard single-slot VME form factor component, occupying one dedicated slot in the IC697 rack assembly.
Field Installation Guidelines
- Power down the host Series 90-70 VME rack chassis and lock out all incoming electrical feeds before inserting or removing the card.
- Put on a grounded electrostatic discharge (ESD) wrist strap attached to the cabinet earth terminal to shield sensitive CMOS circuits.
- Align the IC697BEM742 module card edges with the designated chassis slot guides, pushing firmly until the edge connectors seat completely into the backplane socket.
- Tighten the top and bottom panel captive retaining screws to establish firm mechanical fastening and chassis ground continuity.
- Connect the shielded FIP communication network cables to the front-panel dual channel connectors, ensuring cable shields ground directly to the cabinet entry plate to prevent field noise interference.