{"product_id":"ge-fanuc-ic697bem742-series-90-70-fip-bus-controller-modules","title":"GE Fanuc IC697BEM742 Series 90-70 FIP Bus Controller Modules","description":"\u003ch2\u003eGE Fanuc IC697BEM742 Series 90-70 FIP Bus Controller Modules\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC697BEM742\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC697BEM742\u003c\/strong\u003e FIP Bus Controller Module, operates as a dedicated hardware component for distributed field device communication within Series 90-70 networks. Installed inside a single-slot IC697 VME rack frame, the board routes real-time telemetry and control commands between the central PLC processor and external field nodes over dual FIP network channels.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC697BEM742\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc (GE)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.54 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e172 mm x 33 mm x 142 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003eStandard Industrial Range\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e6.5 W (1.3 A at 5 VDC)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Model\u003c\/td\u003e\n\u003ctd\u003eIC697BEM742\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSeries\u003c\/td\u003e\n\u003ctd\u003eSeries 90-70\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProduct Type\u003c\/td\u003e\n\u003ctd\u003eFIP Bus Controller Modules\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCommunication Protocol\u003c\/td\u003e\n\u003ctd\u003eFactory Instrumentation Protocol (FIP)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eForm Factor\u003c\/td\u003e\n\u003ctd\u003eSingle-slot IC697 VME rack module\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Voltage\u003c\/td\u003e\n\u003ctd\u003e5 VDC backplane supply\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eArchitecture\u003c\/td\u003e\n\u003ctd\u003eDual-channel redundant interface\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eDeterministic Ethernet Networks \u0026amp; Backplane Synchronization\u003c\/h3\u003e\n\u003cp\u003eThe module interfaces directly with the IC697 VME backplane bus, maintaining optimal backplane bus communication velocity while drawing 1.3 A at 5 VDC from the system power supply rail. By leveraging hardware-level determinism over dual Factory Instrumentation Protocol (FIP) communication channels, the controller executes periodic data exchanges with high field I\/O density scaling. Integrated firmware flash compatibility ensures synchronized cyclic scanning across redundant CPU racks without inducing control loop jitter or transmission latency during heavy traffic cycles.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How does the IC697BEM742 module draw power within the IC697 VME rack enclosure?\u003c\/p\u003e\n\u003cp\u003eA: The module draws power directly from the 5 VDC system backplane bus, consuming a rated current of 1.3 A during continuous operation.\u003c\/p\u003e\n\u003cp\u003eQ: Can the IC697BEM742 module be deployed in high-availability redundant architectures?\u003c\/p\u003e\n\u003cp\u003eA: Yes, the board supports redundant dual-channel FIP network topologies to maintain continuous communication links if a primary network path fails.\u003c\/p\u003e\n\u003cp\u003eQ: What physical rack space does the IC697BEM742 occupy inside the Series 90-70 chassis?\u003c\/p\u003e\n\u003cp\u003eA: The module is engineered as a standard single-slot VME form factor component, occupying one dedicated slot in the IC697 rack assembly.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003ePower down the host Series 90-70 VME rack chassis and lock out all incoming electrical feeds before inserting or removing the card.\u003c\/li\u003e\n\u003cli\u003ePut on a grounded electrostatic discharge (ESD) wrist strap attached to the cabinet earth terminal to shield sensitive CMOS circuits.\u003c\/li\u003e\n\u003cli\u003eAlign the IC697BEM742 module card edges with the designated chassis slot guides, pushing firmly until the edge connectors seat completely into the backplane socket.\u003c\/li\u003e\n\u003cli\u003eTighten the top and bottom panel captive retaining screws to establish firm mechanical fastening and chassis ground continuity.\u003c\/li\u003e\n\u003cli\u003eConnect the shielded FIP communication network cables to the front-panel dual channel connectors, ensuring cable shields ground directly to the cabinet entry plate to prevent field noise interference.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":43820627492963,"sku":"IC697BEM742","price":370.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/135_07ac6a42-cc6e-4a2c-82bf-9b0e67e4af2b.jpg?v=1762415600","url":"https:\/\/www.autocontrolglobal.com\/products\/ge-fanuc-ic697bem742-series-90-70-fip-bus-controller-modules","provider":"AutoControl Global","version":"1.0","type":"link"}