GE IC693CPU372-AE Series 90-30 PLC CPU Module Dual Ethernet
Manufacturer: GE Fanuc
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Part Number: IC693CPU372-AE
Condition：New with Original Package
Product Type: CPU Processors
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE IC693CPU372-AE Series 90-30 CPU Module
The GE IC693CPU372-AE, also cataloged as the IC693CPU372 CPU Module, operates as a dedicated hardware component for centralized program execution and real-time network communications within Series 90-30 PLC systems. Driven by a 133 MHz processor, the unit executes boolean logic and floating-point math at 0.15 ms per 1 kB across up to 2,048 discrete inputs/outputs and 32,640 analog words. Dual 10/100 Mbps Ethernet ports handle Modbus TCP/IP and SRTP protocols to exchange data directly with host supervisory systems and networked controllers.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC693CPU372-AE |
| Brand | GE |
| Origin | USA |
| Weight | 0.5 kg (1 lbs 1.6 oz) |
| Dimensions | 3.2 cm x 12.7 cm x 12.7 cm (1.3 in x 5.0 in x 5.0 in) |
| Operating Temp | -40 to +70 deg C |
| Power Consumption | Baseplate Backplane Supply Powered (Nominal System Supply) |
| Processor & Speed | 133 MHz Processor (AMD SC520 or Intel 80386EX depending on revision) |
| User Memory | 240 KB Battery-Backed RAM, Optional Flash/Non-Volatile Memory |
| Execution Speed | 0.15 ms per 1 kB scan time |
| Discrete I/O Capacity | 2,048 Discrete Inputs, 2,048 Discrete Outputs |
| Analog I/O Capacity | Up to 32,640 Analog Input/Output Words |
| Ethernet Interface | Dual 10/100 Mbps Auto-Sensing Ports (Internal Switch Topology) |
| Network Protocols | Modbus TCP/IP, SRTP, Industrial Ethernet |
Firmware Flash Compatibility and Deterministic Backplane Communication
The GE IC693CPU372-AE maintains deterministic communication velocity across the Series 90-30 backplane bus by utilizing integrated switching logic within its dual Ethernet interface. Channel-to-channel backplane synchronization enables real-time logic execution without packet collisions during high-volume data traffic. System firmware flash compatibility ensures stable operational continuity across module hardware revisions while protecting battery-backed RAM during backplane power cycles.
Frequently Asked Questions
Q: How does the dual-port Ethernet interface function in standard network topologies?
A: The onboard dual 10/100 Mbps ports utilize an integrated auto-sensing switch, allowing engineers to connect the controller directly into daisy-chain or ring topologies without requiring an external managed switch.
Q: How is logic retained during complete system power outages?
A: The module relies on battery-backed RAM powered by the baseplate power supply battery, maintaining program logic and data memory intact throughout unpowered intervals.
Q: What offline methods exist to reload application code without a computer interface?
A: Engineers can insert an EZ Store Device into the module to transfer firmware updates and application programs directly into non-volatile flash memory without using a PC running Proficy Machine Edition.
Field Installation Guidelines
Follow these core installation procedures during cabinet integration and module replacement:
- Chassis De-energization: Disconnect main power from the Series 90-30 baseplate rack prior to inserting or extracting the CPU module to protect the backplane edge connector pins.
- Mechanical Alignment: Insert the module into Slot 1 of the baseplate. Pivot the top notch into the rack clip and swing the module downward until the bottom tab locks firmly in place.
- Electrostatic Grounding: Wear a grounded ESD wrist strap throughout installation to prevent static discharge from damaging internal processor chips.
- Network Shield Termination: Route Category 5e/6 Ethernet cables through dedicated low-voltage wireways and terminate shielding to the cabinet central ground bus to mitigate industrial electromagnetic interference.
- Thermal Clearance: Maintain at least 76 mm (3 in) of free vertical space above and below the baseplate assembly to ensure adequate convection cooling across the -40 to +70 deg C operating temperature window.