GE IC694ALG222 PACSystems RX3i Analog Input Module
GE IC694ALG222 PACSystems RX3i Analog Input Module
GE IC694ALG222 PACSystems RX3i Analog Input Module
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GE IC694ALG222 PACSystems RX3i Analog Input Module

  • Manufacturer: GE Fanuc

  • Part Number: IC694ALG222

  • Condition:New with Original Package

  • Product Type: Analog Input Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE Fanuc IC694ALG222 PACSystems RX3i Analog Input Module

Configured for analog voltage acquisition in PACSystems RX3i platforms, the GE Fanuc IC693ALG222 (IC694ALG222 Analog Input Module) provides direct physical/electrical execution. The module converts incoming DC voltage signals from process instrumentation into 12-bit digital values stored in the CPU %AI memory space. Software configurations allow the hardware to operate as either a 16-channel single-ended array or an 8-channel differential network. Supporting voltage ranges of 0 to 10 VDC unipolar and -10 to +10 VDC bipolar, internal analog-to-digital converters execute system updates within milliseconds across the active channel bank.

Hardware Specifications

Parameter Specification
Model IC694ALG222
Brand GE Fanuc / Emerson
Origin USA
Weight 0.30 kg (0.66 lbs)
Dimensions 3.5 cm x 13.0 cm x 13.5 cm
Operating Temp 0 to 60 deg C
Power Consumption 112 mA at 5 VDC (backplane bus); 41 mA at 24 VDC (isolated bus)
Input Channels 16 single-ended or 8 differential (configurable)
Input Ranges 0 to 10 VDC (unipolar), -10 to +10 VDC (bipolar)
Digital Resolution 12-bit (2.5 mV/count at 0 to 10 V; 5 mV/count at -10 to +10 V)
Channel Update Rate 6 ms (16 single-ended channels); 3 ms (8 differential channels)
Accuracy +/-0.25% of full scale at 25 deg C
Input Linearity Less than 1 LSB
Input Impedance Greater than 500 kohm (single-ended); 1 Mohm (differential)
Input Filter Response 200 Hz
Field Isolation 250 VAC continuous; 1500 VAC for 1 minute (field-to-backplane)

Backplane Bus Architecture and Network Determinism

The IC694ALG222 mounts inside any standard I/O slot of a PACSystems RX3i universal or expansion baseplate, establishing high-speed parallel routing across the internal backplane. Optocoupler circuits maintain galvanic field-to-backplane isolation to preserve backplane bus communication velocity and prevent field noise transients from disrupting CPU processing. When deploying multiple high-density analog modules, control engineers manage overall I/O density scaling by balancing internal power draws against available backplane supply capacity. Hardware registers maintain complete firmware flash compatibility, facilitating seamless synchronization with Profinet or EtherNet/IP deterministic networks operating across the master controller.

Frequently Asked Questions

Q: Does the IC694ALG222 support hot-swapping inside a PACSystems RX3i baseplate during system operation?

A: Yes. The PACSystems RX3i hardware architecture supports Hot Insertion and Removal (Hot-Swap) of the module from universal baseplates without interrupting controller execution or removing backplane power.

Q: What power source supplies the 24 VDC isolated rail required by the module?

A: The module draws 41 mA from the isolated 24 VDC supply bus located on the RX3i backplane, which is powered directly by the primary RX3i power supply module installed in the rack.

Q: How do signal line noise rejection characteristics differ between 16-channel and 8-channel wiring modes?

A: Single-ended wiring provides 16 input points sharing a common return line but exhibits higher vulnerability to ground potential differences. Differential wiring uses 8 isolated channel pairs, delivering superior common-mode noise rejection in high-noise electrical environments.

Field Installation Guidelines

  • Power Isolation Protocol: Ensure local field power supplies are turned off prior to landing signal wiring on the 20-terminal removable connector block.
  • Shielding and Grounding Rules: Route field wiring using individually shielded twisted-pair cables. Ground all cable shields at a single point, preferably at the rack ground bar, to prevent ground loop currents.
  • Signal Isolation Separation: Route low-voltage analog voltage signal cables through separate wire ducts isolated from high-voltage AC lines and variable frequency drive output cables.
  • Mechanical Latching: Seat the module lower guide edge into the baseplate slot, pivot the housing upward toward the backplane connector, and press firmly until the top retaining latch clicks into position.
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