{"product_id":"ge-ic694mdl754-cd-pacsystems-rx3i-digital-output-modules","title":"GE IC694MDL754-CD PACSystems RX3i Digital Output Modules","description":"\u003ch2\u003eGE Fanuc IC694MDL754 PACSystems RX3i Output Module\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE Fanuc IC694MDL754-CD\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC694MDL754\u003c\/strong\u003e discrete output module, operates as a dedicated hardware component for driving 12\/24 VDC field devices within PACSystems RX3i platforms. It manages positive logic sourcing signals across 32 output channels equipped with Electronic Short-Circuit Protection (ESCP) for fast fault isolation.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC694MDL754-CD\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc \/ Emerson\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.25 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e36 x 134 x 137 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e300 mA maximum at 5 VDC backplane\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Capacity\u003c\/td\u003e\n\u003ctd\u003e32 discrete output channels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVoltage Range\u003c\/td\u003e\n\u003ctd\u003e10.2 to 30.0 VDC (12\/24 VDC nominal)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOutput Current\u003c\/td\u003e\n\u003ctd\u003e0.75 A maximum per point\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eResponse Time\u003c\/td\u003e\n\u003ctd\u003e0.5 ms maximum (ON\/OFF switching)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eIsolation\u003c\/td\u003e\n\u003ctd\u003e1500 VAC field-to-backplane (1 min), 250 VAC group-to-group\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBuilt-in Protection\u003c\/td\u003e\n\u003ctd\u003eElectronic short-circuit, overcurrent, overtemperature (auto-recovery)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003ePACSystems RX3i Deterministic Backplane \u0026amp; I\/O Scaling\u003c\/h3\u003e\n\u003cp\u003eThe IC694MDL754-CD interfaces directly with the high-speed PACSystems RX3i backplane bus to execute real-time discrete output commands. High-density channel scaling packs 32 protected outputs into a single rack slot, conserving chassis footprint. Backplane bus communication velocity supports high refresh rates without incurring scan delays, while internal firmware compatibility guarantees seamlessly synchronized operations across RX3i baseplates under continuous industrial load conditions.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How does Electronic Short-Circuit Protection (ESCP) handle field wiring faults?\u003c\/p\u003e\n\u003cp\u003eA: Integrated ESCP circuitry continuously monitors channel output currents. Upon detecting an overcurrent or short circuit, the module shuts down the affected point to prevent hardware damage, resuming normal operation automatically once the fault condition clears.\u003c\/p\u003e\n\u003cp\u003eQ: Can this 32-point output module be inserted into an active RX3i baseplate?\u003c\/p\u003e\n\u003cp\u003eA: Yes, PACSystems RX3i backplanes support hot-insertion and hot-removal of I\/O modules, allowing technicians to replace the module without interrupting system backplane power or CPU logic execution.\u003c\/p\u003e\n\u003cp\u003eQ: Which field connector accessories are required to wire the IC694MDL754-CD?\u003c\/p\u003e\n\u003cp\u003eA: Field wiring connects via a removable 36-pin terminal block assembly, utilizing either the IC694TBB032 box-style screw terminal block or the IC694TBS032 spring-clamp terminal block (ordered separately).\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cp\u003eMount the IC694MDL754-CD into any available universal I\/O slot of a PACSystems RX3i baseplate until the rear backplane connectors seat completely. Wire field actuators using an approved IC694TBB032 or IC694TBS032 terminal block, maintaining clear separation between 24 VDC output lines and high-voltage AC power wiring by at least 300 mm. Ground all cable shields at a single chassis ground bus bar near the panel wall. Ensure enclosure convection keeps ambient operating temperatures strictly between 0 and 60 deg C to allow heat dissipation under full 0.75 A per channel output loading.\u003c\/p\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":44484468899939,"sku":"IC694MDL754-CD","price":120.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/537._33274b80-13db-4a3a-b12f-cf1153ac2d9d.jpg?v=1786954582","url":"https:\/\/www.autocontrolglobal.com\/products\/ge-ic694mdl754-cd-pacsystems-rx3i-digital-output-modules","provider":"AutoControl Global","version":"1.0","type":"link"}