GE IC694MDL754 PACSystems RX3i DC Output Module
Manufacturer: GE Fanuc
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Part Number: IC694MDL754-FD
Condition：New with Original Package
Product Type: Digital Output Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC694MDL754 PACSystems RX3i DC Output Module
The GE Fanuc IC694MDL754, also cataloged as the IC694MDL754-FD DC Output Module, operates as a dedicated hardware component for high-density discrete sourcing signal execution within PACSystems RX3i rack platforms.
Suffix Breakdown & Model Matrix
| Base Model | Suffix / Designation | Hardware Revision & Feature Profile |
|---|---|---|
| IC694MDL754 | None | Standard 32-point sourcing DC output module with ESCP protection |
| IC694MDL754 | -FD | Field-diagnostic enabled variant with extended driver fault reporting |
| IC694MDL754 | Version CC/later | External supply consumption: 72 mA/group (OFF), 132 mA/group (ON) |
| IC694MDL754 | Version BC/earlier | External supply consumption: 72 mA/group (OFF), 100 mA/group (ON) |
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL754 |
| Brand | GE Fanuc / Emerson |
| Origin | USA |
| Weight | 0.60 kg (1.31 lbs) |
| Dimensions | 34 x 145 x 140 mm |
| Operating Temp | 0 to 60 deg C (derate above 42 deg C at 30 VDC) |
| Power Consumption | 300 mA maximum from 5 VDC backplane bus |
| Number of Channels | 32 sourcing output points (2 isolated groups of 16) |
| Operating Voltage Range | 10.2 to 30 VDC (12/24 VDC nominal) |
| Output Current Rating | 0.75 A per point (3.0 A inrush for 10 ms) |
| On-State Voltage Drop | 0.3 VDC maximum |
| Response Time | 0.5 ms maximum (turn-ON and turn-OFF) |
| Isolation | 250 VAC continuous / 1500 VAC for 1 minute (field to backplane and group to group) |
High-Density Logic Execution and Backplane Bus Synchronization
The IC694MDL754 coordinates real-time signal processing via high-velocity backplane bus communication across the PACSystems RX3i chassis. By utilizing dynamic I/O density scaling, the card consolidates 32 sourcing channels into a single slot width, offloading processing overhead from the central CPU. Integrated Elektronik Short-Circuit Protection (ESCP) monitors current draw per channel, automatically resetting following fault clearing without requiring user fuse replacement. Furthermore, maintaining strict firmware flash compatibility across RX3i CPU revisions ensures deterministic scan execution and continuous hardware status reporting.
Frequently Asked Questions
Q: Can the IC694MDL754 module be integrated into a legacy Series 90-30 PLC backplane?
A: No, the IC694MDL754 is designed specifically for the PACSystems RX3i platform and requires an RX3i CPU with compatible firmware. It cannot be operated on Series 90-30 CPUs.
Q: How does the ESCP circuit respond during an overcurrent or short-circuit condition on a channel?
A: The internal ESCP logic trips to limit fault current, shutting down the affected output driver. Once the overcurrent or overtemperature condition is cleared, the driver attempts auto-recovery to restore normal output conduction.
Field Installation Guidelines
Always isolate the main backplane power and external 24 VDC field supplies before inserting or removing the module. Seat the IC694MDL754 firmly into the targeted RX3i slot, ensuring the upper and lower housing clips engage the baseplate rail. Wire the external field power and output loads using an approved 36-pin terminal block, such as the IC694TBB032 box-style or IC694TBS032 spring-clamp terminal connector. Route output signal wiring separate from high-voltage AC conductors, and bond all field cable shield drain wires directly to the enclosure ground bar to mitigate electromagnetic interference.