GE IC695CHS007-BA PACSystems RX3i 7-Slot Base Rack Chassis
Manufacturer: GE Fanuc
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Part Number: IC695CHS007-BA
Condition：New with Original Package
Product Type: PLC Chassis Racks
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE IC695CHS007-BA PACSystems RX3i 7-Slot Base Rack
Configured for structural mounting and backplane bus distribution in PACSystems RX3i control systems, the GE IC695CHS007-BA (IC695CHS007 7-Slot Base Rack) provides direct physical/electrical execution.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695CHS007-BA |
| Brand | GE Fanuc |
| Origin | USA |
| Weight | 2.50 kg |
| Dimensions | 304.8 x 304.8 x 177.8 mm |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | Passive backplane frame |
| Total Slots | 7 module slots |
| Backplane Bus Type | Universal RX3i high-speed backplane |
| Power Supply Slot | Dedicated leftmost slot |
| CPU Placement | Slot 1 |
| Mounting Options | Panel mount or standard enclosure enclosure mounting |
| Operating Humidity | 5 to 95% RH non-condensing |
| Compliance | UL, CE, CSA |
Backplane Bus Communication Velocity and Firmware Compatibility
The internal printed circuit board routing within the chassis guarantees high backplane bus communication velocity for both PCI high-speed and serial communication channels across all seven slots. Dedicated trace layout prevents signal attenuation during intensive I/O scans. The backplane design ensures universal firmware flash compatibility across mixed generations of RX3i central processors, power supply modules, and digital or analog expansion units mounted within the frame.
Frequently Asked Questions
Q: Can any standard RX3i module be inserted into any of the available slots?
A: The power supply module must occupy the dedicated leftmost slot and the central processing unit resides in Slot 1. The remaining five slots accept standard discrete, analog, and specialty I/O modules without slot-type restrictions.
Q: How is chassis grounding established to maintain backplane noise immunity?
A: Grounding clips on the rear frame establish direct mechanical contact with the metal panel backplate. Dedicated protective earth (PE) grounding terminals must connect to the central ground bus using heavy-gauge copper conductors.
Q: What physical precautions are required during hot-swapping or module removal?
A: Always release the upper and lower retention clips before pulling a module straight out of the slot to prevent uneven mechanical stress on the backplane pin connectors.
Field Installation Guidelines
Mount the rack vertically inside an industrial enclosure using heavy-duty hardware through the designated mounting holes. Ensure a minimum clearance of 100 mm above and below the chassis frame to facilitate passive thermal convection and unhindered module extraction. Run high-voltage field wiring in separate wire ducts away from the backplane to prevent electromagnetic interference. Tighten all panel mounting bolts securely to ensure continuous frame-to-backplate electrical bonding.