{"product_id":"ge-ic695chs007-ba-pacsystems-rx3i-7-slot-base-rack-chassis","title":"GE IC695CHS007-BA PACSystems RX3i 7-Slot Base Rack Chassis","description":"\u003ch2\u003eGE IC695CHS007-BA PACSystems RX3i 7-Slot Base Rack\u003c\/h2\u003e\n\u003cp\u003eConfigured for structural mounting and backplane bus distribution in PACSystems RX3i control systems, the \u003cstrong\u003eGE IC695CHS007-BA\u003c\/strong\u003e (\u003cstrong\u003eIC695CHS007\u003c\/strong\u003e 7-Slot Base Rack) provides direct physical\/electrical execution.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC695CHS007-BA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE Fanuc\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e2.50 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e304.8 x 304.8 x 177.8 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to 60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003ePassive backplane frame\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTotal Slots\u003c\/td\u003e\n\u003ctd\u003e7 module slots\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBackplane Bus Type\u003c\/td\u003e\n\u003ctd\u003eUniversal RX3i high-speed backplane\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Supply Slot\u003c\/td\u003e\n\u003ctd\u003eDedicated leftmost slot\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCPU Placement\u003c\/td\u003e\n\u003ctd\u003eSlot 1\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMounting Options\u003c\/td\u003e\n\u003ctd\u003ePanel mount or standard enclosure enclosure mounting\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Humidity\u003c\/td\u003e\n\u003ctd\u003e5 to 95% RH non-condensing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCompliance\u003c\/td\u003e\n\u003ctd\u003eUL, CE, CSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity and Firmware Compatibility\u003c\/h3\u003e\n\u003cp\u003eThe internal printed circuit board routing within the chassis guarantees high backplane bus communication velocity for both PCI high-speed and serial communication channels across all seven slots. Dedicated trace layout prevents signal attenuation during intensive I\/O scans. The backplane design ensures universal firmware flash compatibility across mixed generations of RX3i central processors, power supply modules, and digital or analog expansion units mounted within the frame.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Can any standard RX3i module be inserted into any of the available slots?\u003c\/p\u003e\n\u003cp\u003eA: The power supply module must occupy the dedicated leftmost slot and the central processing unit resides in Slot 1. The remaining five slots accept standard discrete, analog, and specialty I\/O modules without slot-type restrictions.\u003c\/p\u003e\n\u003cp\u003eQ: How is chassis grounding established to maintain backplane noise immunity?\u003c\/p\u003e\n\u003cp\u003eA: Grounding clips on the rear frame establish direct mechanical contact with the metal panel backplate. Dedicated protective earth (PE) grounding terminals must connect to the central ground bus using heavy-gauge copper conductors.\u003c\/p\u003e\n\u003cp\u003eQ: What physical precautions are required during hot-swapping or module removal?\u003c\/p\u003e\n\u003cp\u003eA: Always release the upper and lower retention clips before pulling a module straight out of the slot to prevent uneven mechanical stress on the backplane pin connectors.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cp\u003eMount the rack vertically inside an industrial enclosure using heavy-duty hardware through the designated mounting holes. Ensure a minimum clearance of 100 mm above and below the chassis frame to facilitate passive thermal convection and unhindered module extraction. Run high-voltage field wiring in separate wire ducts away from the backplane to prevent electromagnetic interference. Tighten all panel mounting bolts securely to ensure continuous frame-to-backplate electrical bonding.\u003c\/p\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":44486310953059,"sku":"IC695CHS007-BA","price":120.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/546.1_7dbd8b05-c74d-4f64-929c-ae64a0d44c14.jpg?v=1787047225","url":"https:\/\/www.autocontrolglobal.com\/products\/ge-ic695chs007-ba-pacsystems-rx3i-7-slot-base-rack-chassis","provider":"AutoControl Global","version":"1.0","type":"link"}