GE IC695CMX128 PACSystems RX3i 128MB Reflective Memory Module
Manufacturer: GE Fanuc
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Part Number: IC695CMX128
Condition：New with Original Package
Product Type: Reflective Memory Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE IC695CMX128 PACSystems RX3i Reflective Memory Module
The GE IC695CMX128, also cataloged as the IC695CMX128 Reflective Memory Module, operates as a dedicated hardware component for deterministic shared-memory data replication within PACSystems RX3i platforms. The module provides 128 MB of onboard reflective memory linked via dual LC fiber-optic connections operating at up to 2.12 Gbaud. Transferring data across up to 256 nodes with node-to-node latency under 1.2 microseconds, the board bypasses standard network protocol overhead to execute real-time local memory writes across distributed RX3i backplane racks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC695CMX128 |
| Brand | GE |
| Origin | USA |
| Weight | 0.45 kg |
| Dimensions | 50 mm x 160 mm x 120 mm |
| Operating Temp | -40 to +70 deg C |
| Power Consumption | Baseplate Backplane Supply Powered (RX3i Bus) |
| Memory Capacity | 128 MB Shared Reflective Memory |
| Baud Rate | Up to 2.12 Gbaud |
| Node Latency | Less than 1.2 microseconds per node |
| Node Capacity | Up to 256 nodes per network |
| Physical Media | Multimode or Single-Mode Fiber (Dual LC Connectors) |
| Max Transmission Distance | Up to 10 km (configuration dependent) |
Backplane Bus Communication Velocity and System Determinism
The GE IC695CMX128 module directly maps field changes into its 128 MB local RAM array while maintaining high backplane bus communication velocity across the PACSystems RX3i rack structure. The dedicated optical engine handles automatic packet routing and cross-node synchronization without burdening the host CPU scan cycle. Onboard firmware flash compatibility ensures synchronized parameter scaling and stable memory allocation patterns across expanded I/O density networks.
Frequently Asked Questions
Q: How does the module handle backplane power consumption and signal distribution?
A: The module draws operational power directly from the RX3i baseplate rack backplane, utilizing regulated internal rails to power the optical transceivers and memory management circuits.
Q: Can the module be installed or hot-swapped while the backplane is energized?
A: Hot insertion and removal depend on the specific PACSystems RX3i rack type; while universal backplanes allow hot-swapping, engineers must ensure the optical ring topology is temporarily bypassed to prevent ring interruption during live card replacement.
Q: How does the hardware maintain deterministic data exchange across multi-node loops?
A: Any write operation to the local 128 MB RAM is automatically converted into optical frames and propagated around the fiber ring, updating the matching RAM locations on all attached nodes in under 1.2 microseconds per node.
Field Installation Guidelines
Follow these standardized procedures when integrating the reflective memory module into field enclosures:
- Chassis De-energization: Turn off the RX3i rack power supply before sliding the module into its assigned baseplate slot to prevent edge connector arc damage.
- Mechanical Alignment & Seating: Align the card with the upper and lower guide rails of the RX3i slot. Push the module inward until the rear connectors engage fully with the backplane, securing top and bottom retaining latches.
- ESD Precautions: Wear a grounded ESD wrist strap during handling to protect high-speed optical circuitry and RAM chips from static discharge.
- Fiber-Optic Cable Routing: Connect LC fiber cables to the transceiver ports. Maintain a minimum bend radius of 30 mm for standard optical patch cables to prevent signal attenuation and optical link failure.
- Thermal Management: Keep vertical airflow paths clear around the card cage to allow natural convection, ensuring ambient operating temperatures remain within -40 to +70 deg C.