{"product_id":"ge-ic695cmx128-pacsystems-rx3i-128mb-reflective-memory-module","title":"GE IC695CMX128 PACSystems RX3i 128MB Reflective Memory Module","description":"\u003ch2\u003eGE IC695CMX128 PACSystems RX3i Reflective Memory Module\u003c\/h2\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE IC695CMX128\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eIC695CMX128\u003c\/strong\u003e Reflective Memory Module, operates as a dedicated hardware component for deterministic shared-memory data replication within PACSystems RX3i platforms. The module provides 128 MB of onboard reflective memory linked via dual LC fiber-optic connections operating at up to 2.12 Gbaud. Transferring data across up to 256 nodes with node-to-node latency under 1.2 microseconds, the board bypasses standard network protocol overhead to execute real-time local memory writes across distributed RX3i backplane racks.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eIC695CMX128\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.45 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e50 mm x 160 mm x 120 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-40 to +70 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003eBaseplate Backplane Supply Powered (RX3i Bus)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMemory Capacity\u003c\/td\u003e\n\u003ctd\u003e128 MB Shared Reflective Memory\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBaud Rate\u003c\/td\u003e\n\u003ctd\u003eUp to 2.12 Gbaud\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNode Latency\u003c\/td\u003e\n\u003ctd\u003eLess than 1.2 microseconds per node\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNode Capacity\u003c\/td\u003e\n\u003ctd\u003eUp to 256 nodes per network\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePhysical Media\u003c\/td\u003e\n\u003ctd\u003eMultimode or Single-Mode Fiber (Dual LC Connectors)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMax Transmission Distance\u003c\/td\u003e\n\u003ctd\u003eUp to 10 km (configuration dependent)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity and System Determinism\u003c\/h3\u003e\n\u003cp\u003eThe \u003cstrong\u003eGE IC695CMX128\u003c\/strong\u003e module directly maps field changes into its 128 MB local RAM array while maintaining high backplane bus communication velocity across the PACSystems RX3i rack structure. The dedicated optical engine handles automatic packet routing and cross-node synchronization without burdening the host CPU scan cycle. Onboard firmware flash compatibility ensures synchronized parameter scaling and stable memory allocation patterns across expanded I\/O density networks.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How does the module handle backplane power consumption and signal distribution?\u003c\/p\u003e\n\u003cp\u003eA: The module draws operational power directly from the RX3i baseplate rack backplane, utilizing regulated internal rails to power the optical transceivers and memory management circuits.\u003c\/p\u003e\n\u003cp\u003eQ: Can the module be installed or hot-swapped while the backplane is energized?\u003c\/p\u003e\n\u003cp\u003eA: Hot insertion and removal depend on the specific PACSystems RX3i rack type; while universal backplanes allow hot-swapping, engineers must ensure the optical ring topology is temporarily bypassed to prevent ring interruption during live card replacement.\u003c\/p\u003e\n\u003cp\u003eQ: How does the hardware maintain deterministic data exchange across multi-node loops?\u003c\/p\u003e\n\u003cp\u003eA: Any write operation to the local 128 MB RAM is automatically converted into optical frames and propagated around the fiber ring, updating the matching RAM locations on all attached nodes in under 1.2 microseconds per node.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cp\u003eFollow these standardized procedures when integrating the reflective memory module into field enclosures:\u003c\/p\u003e\n\u003col\u003e\n\u003cli\u003e\n\u003cstrong\u003eChassis De-energization\u003c\/strong\u003e: Turn off the RX3i rack power supply before sliding the module into its assigned baseplate slot to prevent edge connector arc damage.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMechanical Alignment \u0026amp; Seating\u003c\/strong\u003e: Align the card with the upper and lower guide rails of the RX3i slot. Push the module inward until the rear connectors engage fully with the backplane, securing top and bottom retaining latches.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eESD Precautions\u003c\/strong\u003e: Wear a grounded ESD wrist strap during handling to protect high-speed optical circuitry and RAM chips from static discharge.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFiber-Optic Cable Routing\u003c\/strong\u003e: Connect LC fiber cables to the transceiver ports. Maintain a minimum bend radius of 30 mm for standard optical patch cables to prevent signal attenuation and optical link failure.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThermal Management\u003c\/strong\u003e: Keep vertical airflow paths clear around the card cage to allow natural convection, ensuring ambient operating temperatures remain within -40 to +70 deg C.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"GE Fanuc","offers":[{"title":"Default Title","offer_id":43871127273571,"sku":"IC695CMX128","price":120.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0583\/5246\/8067\/files\/365.1_2cd3d94a-60f1-493b-ade8-57561cea58a0.jpg?v=1764837513","url":"https:\/\/www.autocontrolglobal.com\/products\/ge-ic695cmx128-pacsystems-rx3i-128mb-reflective-memory-module","provider":"AutoControl Global","version":"1.0","type":"link"}