GE IS200VTCCH1C Mark VI Speedtronic VME Thermocouple Input Board
Manufacturer: GE Fanuc
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Part Number: IS200VTCCH1C
Condition：New with Original Package
Product Type: Thermocouple Input Boards
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE IS200VTCCH1C Mark VI Thermocouple Input Board
Configured for Specific Technical Task in System/Network Name, the GE IS200VTCCH1C (IS200VTCC VME Thermocouple Input Board) provides direct physical/electrical execution. The hardware operates as a dedicated processing card that translates low-millivolt analog thermocouple signals directly into digital temperature metrics across the VME backplane layer.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IS200VTCCH1C (also revision IS200VTCCH1CBB) |
| Brand | General Electric (GE) |
| Origin | USA |
| Weight | 0.5 kg (1.1 lbs) |
| Dimensions | 33 cm x 17.8 cm |
| Operating Temp | -20 to +70 deg C |
| Power Consumption | Passive backplane logic draw |
| Series | Mark VI (Speedtronic Turbine Control System) |
| Product Type | VME Thermocouple Input Board |
| Input Channels | 12 independent thermocouple inputs |
| Supported Thermocouple Types | J, K, E, T, N, R, S, B |
| Measurement Range | -40 to +1200 deg C (depending on thermocouple type) |
| Accuracy | +/- 2 deg C typical |
| Cold Junction Compensation | On-board |
| Isolation | Electrical isolation between channels and backplane |
| Signal Conditioning | Filtering and linearization |
| Connector Type | Terminal block for field wiring |
| Storage Temperature | -40 to +85 deg C |
| Installation | Rack-mounted, hot-swappable |
Industrial Control and Deterministic Network Operations
The control hardware employs specialized backplane bus communication velocity parameters to synchronize multi-rack system Topologies. Deterministic data transmission over industrial networks utilizes embedded Profinet or EtherNet/IP protocols to execute time-critical synchronization routines. Firmware flash compatibility rules require consistent microcode versions across both active and redundant backup processing nodes. The hardware layer enforces physical network isolation through dedicated MAC addressing structures, managing high I/O density scaling profiles without degradation of standard cyclic task schedules or execution jitter loops.
Frequently Asked Questions
Q: How does the hardware manage reference junction variations without external hardware? A: The board executes real-time temperature tracking via on-board cold junction compensation (CJC) circuits, stabilizing input linearization across varying ambient operating conditions.
Q: What physical constraints dictate hot-swap component changes on a live system? A: The VME board design allows hot-swappable insertion and extraction directly within standard Mark VI rack slots without requiring complete power isolation, provided field terminal block disconnects match sequence limits.
Field Installation Guidelines
Isolate external field loops and verify electrostatic discharge protection before sliding the card into the VME slot architecture. Position the module within the designated Mark VI rack guides, advancing the hardware smoothly until the rear connectors mate with the passive backplane. Grounding integrity relies on clean metal contact between the front faceplate fasteners and the grounded sub-rack enclosure. Connect the field sensor cables to the dedicated terminal block interfaces using shielded twisted pair extension wires appropriate for the chosen sensor profile. Route low-level thermocouple wiring separate from power distribution cabling to prevent inductive noise injection from bypassing the integrated filtering components.