GE PACSystems RX3i IC694MDL740 Digital Output Modules
Manufacturer: GE Fanuc
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Part Number: IC694MDL740-A
Condition：New with Original Package
Product Type: Digital Output Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE PACSystems RX3i IC694MDL740 Digital Output Module
The GE PACSystems RX3i IC694MDL740, also cataloged as the IC694MDL740 Digital Output Module, operates as a dedicated hardware component for sourcing discrete signal switching within PACSystems RX3i networks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC694MDL740 |
| Brand | GE / GE PACSystems |
| Origin | USA |
| Weight | 0.48 kg (1.06 lbs) |
| Dimensions | Single-slot RX3i module chassis size |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | 110 mA from +5 VDC backplane bus supply (all outputs ON) |
| Output Type | Positive Logic (Sourcing) |
| Number of Channels | 16 outputs (2 groups of 8 channels each) |
| Rated Output Voltage | 12/24 VDC (operating range 12 to 24 VDC +20%, -15%) |
| Output Current Rating | 0.5 A maximum per point (2.0 A maximum per module/common) |
| Maximum Inrush Current | 4.78 A for 10 ms |
| Internal Voltage Drop | 0.5 VDC maximum at rated current |
| Switching Response Time | 2 ms maximum ON / 2 ms maximum OFF |
| Isolation | 250 VAC continuous / 1500 VAC for 1 minute (field-to-backplane and group-to-group) |
Deterministic Backplane Execution & Logic Switching
The module processes discrete field actuation by exchanging digital channel data over high-speed backplane bus communication velocity Licences. Operating on positive sourcing logic, the unit controls 16 individual 12/24 VDC loads, such as solenoids, relays, and status indicators, by sourcing power from an external field supply. Integrated firmware flash compatibility maintains continuous scan synchronization with central RX3i CPUs, delivering deterministic state transitions under 2 ms delay limits. Galvanic optical isolation rated at 1500 VAC protects internal backplane logic from field-side voltage spikes and ground loop noise.
Frequently Asked Questions
Q: Does the IC694MDL740 module include built-in internal fusing for field output channels?
A: No internal fusing is provided on the module circuit assembly; field wiring design requires installing external fast-acting fuses to prevent channel damage from short circuits.
Q: What power rail budget must be allocated for this module on the RX3i backplane?
A: System power planning requires allocating a current load of 110 mA directly from the +5 VDC backplane supply rail when all 16 output channels are continuously active.
Q: Can this module be installed in any available I/O slot within an RX3i baseplate?
A: Yes, the unit fits into any standard I/O slot of an RX3i Universal Baseplate or Expansion Baseplate, receiving automatic slot configuration mapping from the main CPU.
Field Installation Guidelines
- Power Isolation & ESD Safeguards: De-energize all main rack power supplies and external 12/24 VDC field circuit supplies before module installation. Attach a grounded ESD wrist strap to the panel metal enclosure.
- Physical Slot Mounting: Insert the module circuit board into the guide channels of the selected RX3i baseplate I/O slot, pressing firmly until top and bottom retention latches lock into position.
- Field Terminal Wiring: Connect external 12/24 VDC positive power leads to the designated group common terminals on the removable terminal block, wiring individual loads to output terminals 1 through 16.
- Wiring Separation & Routing: Route all low-voltage DC field conductors in dedicated panel wiring ducts, maintaining a minimum 30 cm clearance from high-voltage AC power lines.
- Inductive Load Protection: Install external flyback suppression diodes across all field-mounted DC inductive solenoids and relay coils to eliminate back-EMF voltage transients during switching.