Honeywell 51153818-203 TDC3000 Jumper Interconnection Kits
Manufacturer: Honeywell
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Part Number: 51153818-203
Condition：New with Original Package
Product Type: Jumper Interconnection Kit
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
Honeywell 51153818-203 TPS/TDC Series
The Honeywell 51153818-203, also cataloged as the Honeywell 51153818 Jumper Interconnection Kit, operates as a dedicated hardware component for localized routing of low-voltage bus signals within TPS, TDC2000, and TDC3000 Distributed Control Systems. The hardware establishes physical electrical continuity across adjacent backplane pins to patch distinct I/O nodes without structural alterations to the core system backplane architecture.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 51153818-203 |
| Brand | Honeywell |
| Origin | USA |
| Weight | 0.56 kg |
| Dimensions | 3 x 31.3 x 27.8 cm |
| Operating Temp | -20 deg C to +70 deg C |
| Power Consumption | 0 W (Passive electrical component) |
| Type | Jumper Kit (I/O Interconnection Accessory) |
| Jumper Quantity | 21-30 wire jumpers |
| Jumper Pitch | 2.54 mm |
| Material | Industrial-grade conductor wire and termination connectors |
| Operating Voltage | Standard system bus voltage (low-voltage signal) |
| Certifications | CE, TUV, UL508, CSA |
Distributed Control System Loop Integration
The hardware interconnect matrix routes low-voltage analog and digital instrumentation signals across backplane segments before they enter the distributed control system (DCS) processing layer. By establishing direct conductive mapping across a 2.54 mm pitch layout, this assembly facilitates unattenuated pass-through for 4-20 mA HART loop protocol variables and high-speed system bus communications. The solid wire properties preserve the signal-to-noise ratio required by high-density analog modules, maintaining channel integrity against cross-talk without altering pre-existing channel-to-channel isolation barriers on the primary I/O board.
Frequently Asked Questions
Q: What is the physical spacing layout of the individual pins within this interconnection module? A: The kit utilizes a standard jumper pitch of 2.54 mm, ensuring mechanical compatibility with the pin grids found on legacy TDC and modern TPS backplane components.
Q: Does the 51153818-203 kit require external electrical excitation or software configuration? A: No, the hardware consists of passive conductor wires and connectors that operate solely on the system bus low-voltage signal layer, requiring zero power draw and no software mapping.
Q: Can this jumper assembly handle high-voltage alternating current (VAC) power circuits? A: No, the design parameters restrict usage strictly to low-voltage system bus signaling and logic-level interconnection points.
Field Installation Guidelines
- Verify that the primary distributed control system chassis is powered down before introducing or removing any wire jumpers from the backplane connectors.
- Align the 2.54 mm pitch connector blocks perfectly with the target pin header rows on the TPS/TDC backplane to avoid bending or shorting adjacent pins.
- Route the integrated wire bundles away from active high-voltage lines or inductive switching components inside the enclosure to mitigate electromagnetic coupling risks.
- Ensure the physical locking features of the connectors are fully seated to withstand mechanical vibrations and maintain continuous circuit contact within industrial panels.