IC200MDD840G GE VersaMax 32 Point Mixed Discrete I/O Module
IC200MDD840G GE VersaMax 32 Point Mixed Discrete I/O Module
IC200MDD840G GE VersaMax 32 Point Mixed Discrete I/O Module
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IC200MDD840G GE VersaMax 32 Point Mixed Discrete I/O Module

  • Manufacturer: GE Fanuc

  • Part Number: IC200MDD840G

  • Condition:New with Original Package

  • Product Type: Discrete I/O Modules

  • Country of Origin: USA

  • Payment:T/T, Western Union

  • Shipping port: Xiamen

  • Warranty: 12 months

GE IC200MDD840G VersaMax Mixed Discrete I/O Module

Configured for discrete field signal acquisition and load switching in GE VersaMax PLC platforms, the GE IC200MDD840G (IC200MDD840 Mixed Discrete I/O Module) provides direct physical/electrical execution. Field technicians mount this 32-point combination module onto standard VersaMax carrier bases where it routes 20 positive-logic 24 VDC input signals and drives 12 output contacts (including Form A relay channels). Channel-to-backplane optical isolation shields internal processing circuits from field-side voltage spikes, while individual front-panel LEDs provide immediate visual diagnostics for every I/O point and system status.

Hardware Specifications

Parameter Specification
Model IC200MDD840G / IC200MDD840
Brand GE (GE Fanuc / Emerson)
Origin United States
Weight 0.1 kg (0.68 kg package weight)
Dimensions 10.9 x 6.4 x 5.8 cm
Operating Temp 0 to 60 deg C
Power Consumption 375 mA maximum from 5 VDC backplane
Total I/O Channels 32 channels (20 inputs, 12 outputs)
Input Rating 24 VDC nominal (0 to 30 VDC range, 2.0 to 5.5 mA ON-state)
Relay Output Rating 2.0 A at 5 to 265 VAC / 5 to 30 VDC; 0.2 A at 31 to 125 VDC
Response Time ON: <= 0.5 ms, OFF: <= 0.5 ms
Channel Isolation 1500 VAC between field side and logic side; isolated relay output groups
Tariff Code (HS Code) 8538907080

Backplane Bus Communication Velocity and System Integration

The mixed I/O module transfers discrete input and output states across the internal rack carrier, maintaining backplane bus communication velocity across expanded VersaMax sub-racks. Optical isolation hardware isolates internal processing components from high-voltage field disturbances, which prevents communication dropouts over connected EtherNet/IP and Profinet deterministic networks. Built-in firmware flash compatibility allows the VersaMax CPU to automatically identify the hardware node during system power-up, enabling high I/O density scaling without introducing scan time delays.

Frequently Asked Questions

Q: Can maintenance teams hot-swap the IC200MDD840G module while the VersaMax rack is powered?

A: Technical personnel must disconnect main backplane logic power and field voltage supply loops before removing or installing the module to prevent electrical arcing and backplane communication faults.

Q: What are the continuous resistive load limits for the onboard Form A relay output channels?

A: Each relay channel handles up to 2.0 A continuous resistive load at 5-265 VAC or 5-30 VDC, and up to 0.2 A continuous at higher DC voltages between 31 and 125 VDC.

Q: Does the IC200MDD840G module draw power from the backplane to drive external field output loads?

A: The backplane supplies up to 375 mA at 5 VDC solely to power onboard logic circuits and LEDs; external field supplies or load circuits must provide power for field-side output driving.

Field Installation Guidelines

Execute the following sequential steps during panel assembly and cabinet wiring:

  1. De-energize primary enclosure power feeds and disconnect external field power sources before inserting hardware.
  2. Align the module housing over the designated VersaMax carrier base slot and press firmly until the locking mechanisms click into position.
  3. Wire field conductors to the removable terminal block, maintaining clear separation between low-voltage 24 VDC input lines and AC relay output circuits.
  4. Route signal cables through dedicated wire raceways separated from high-voltage motor drive conductors to reduce electromagnetic interference.
  5. Ground all cable shields directly to the main enclosure grounding bar using short copper leads, then reapply power to inspect the OK status LED.
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