IC200MDD844K GE VersaMax Mixed I/O Module Discrete Signal Processing
Manufacturer: GE Fanuc
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Part Number: IC200MDD844K
Condition：New with Original Package
Product Type: Mixed I/O Modules
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Country of Origin: USA
Payment:T/T, Western Union
Shipping port: Xiamen
Warranty: 12 months
GE Fanuc IC200MDD844K VersaMax Mixed I/O Module
Configured for discrete signal acquisition and real-time control output in VersaMax PLC networks, the GE Fanuc IC200MDD844K (IC200MDD844K Mixed I/O Module) provides direct physical/electrical execution. This high-density hardware interface consolidates 24 discrete DC inputs and 20 discrete DC sourcing outputs into a single modular enclosure. Operating on a nominal 24 VDC supply, the unit routes field-level sensor, switch, and actuator states directly to the main rack processor via backplane logic integration. Integrated optical isolation shields internal processing circuits against high-voltage transients on field wiring paths.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC200MDD844K |
| Brand | GE Fanuc |
| Origin | USA |
| Weight | 0.35 kg |
| Dimensions | 120 mm x 90 mm x 40 mm |
| Operating Temp | 0 deg C to 60 deg C |
| Power Consumption | 24 VDC field power / backplane logic dependent |
| Input Points | 24 VDC discrete (positive logic / sourcing) |
| Output Points | 20 VDC discrete (0.5 A per point, 2 A per common) |
| Field-to-Logic Isolation | 1500 VAC peak |
| Switching Latency | 0.5 ms maximum ON/OFF |
Backplane Bus Communication & I/O Scaling Profiles
The module interfaces directly with the VersaMax backplane bus structure, utilizing dedicated high-speed protocol exchanges to maintain low system latency. Internal logic converts incoming 24 VDC field signals into digital states transferred across the backplane within a single execution cycle. Firmware flash compatibility ensures seamless recognition across standard VersaMax CPU racks and remote expansion bases. High I/O density scaling allows control panels to expand channel counts up to 44 total points without consuming additional slot space or exceeding backplane power distribution limits.
Frequently Asked Questions
Q: What is the isolation rating between the field-side wiring and the backplane logic?
A: The internal optical isolation circuitry supports up to 1500 VAC continuous galvanic separation between field terminals and internal logic lines to prevent ground loops and surge damage.
Q: How does channel loading affect maximum current capacity per output group?
A: While individual channel outputs deliver up to 0.5 A at 24 VDC, aggregate output load must not exceed 2 A per common bus return to prevent thermal overload on internal trace layers.
Field Installation Guidelines
Mount the unit directly onto standard 35 mm DIN rails or secure it via panel mounting holes. Strip field wire leads to specified lengths and seat them firmly into the removable terminal block assembly. Route 24 VDC power supply leads separately from high-voltage AC lines to minimize electromagnetic coupling. Ensure field wiring shields connect to a dedicated single-point earth ground lug. Maintain a minimum 50 mm clearance above and below the module enclosure for unobstructed natural convection cooling.